Display Carrier Integrated Light Bar for Thin LCDs
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Solution Overview
Problem
Conventional LED backlit displays are limited in thickness reduction due to the need for metal core printed circuit boards (MCPCBs) for thermal dissipation, which constrain the thickness of the light bars and subsequently the entire display component.
Innovation Solution
Directly mounting LEDs onto a display carrier with integrated thermal conductive properties, forming traces on the carrier for electrical connection, and using the carrier as a substrate to reduce thickness and enhance thermal dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional MCPCBs are used for thermal dissipation, then thermal management is improved, but device thickness increases
Solution Approach 1:
The patent merges the PCB substrate and heat sink into a single integrated MCPCB structure. The metal core provides both electrical circuit functionality and thermal dissipation, eliminating the need for separate heat sink components and reducing overall device thickness while maintaining effective thermal management.
Solution Approach 2:
The MCPCB structure serves multiple functions simultaneously: it acts as the electrical circuit board, thermal management system, and mechanical support structure. This multi-functionality reduces the number of separate components needed, thereby reducing device thickness while maintaining thermal dissipation performance.
2Length of moving object
If display components are reduced in thickness, then device portability is improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The patent changes the material parameters of the PCB substrate by using metal core materials with high thermal conductivity. This allows the thermal dissipation capability to be maintained or improved even as the overall display thickness is reduced, as the metal core provides efficient heat pathways in a thinner profile.
Solution Approach 2:
The MCPCB uses composite material construction combining metal core with ceramic or polymer layers. This composite structure provides both the mechanical and electrical properties of a PCB and the superior thermal conductivity of metal, enabling thin-profile displays with effective thermal management.
3Ease of manufacture
If LEDs are mounted on separate strips, then manufacturing flexibility is improved, but assembly complexity increases
Solution Approach 1:
The patent merges the LED mounting substrate with the display carrier into a single integrated structure. LEDs are mounted directly on the MCPCB which is already attached to the display carrier, eliminating separate mounting steps and reducing assembly complexity while maintaining manufacturing flexibility.
Solution Approach 2:
The MCPCB serves as both the electrical circuit board and the mounting substrate for LEDs. This universal structure eliminates the need for separate mounting plates or additional structural components, simplifying the assembly process while maintaining the flexibility to position LEDs according to design requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a significant reduction in the thickness of LED backlit displays while improving thermal management, potentially increasing the lifespan of LEDs and simplifying alignment processes during assembly.
Implementation Method 1
a display carrier to receive one or more components of a display stack... the LEDs in thermal communication with the display carrier
Implementation Method 2
a first light emitting diode (LED) disposed on the first surface, the first LED in electrical communication with the trace
Data Source
AI summary
Disclosed herein are techniques to incorporate a light bar for a backlit liquid crystal display (LCD) onto a display carrier for the display. In particular, a display carrier for a display stack may have traces formed thereon and light emitting diodes (LEDs) disposed on the display carrier operably coupled to the traces. The LEDs to provide light to illuminate pixels in the display.