Display Device Carrier Substrate Circuit Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional display devices with high-resolution requirements face increased complexity and manufacturing costs due to high-density LED and circuit module arrangements on opposite surfaces of circuit boards, necessitating multi-layered structures that complicate manufacturing.
Innovation Solution
The display device features a carrier with light emitting elements on its top surface and a circuit unit on a separate substrate, allowing for reduced layer count and thickness by separating these components, simplifying manufacturing and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If LEDs and circuit modules are disposed on opposite surfaces of a circuit board in high density, then the display resolution is improved, but the circuit board requires multi-layered structure which increases manufacturing complexity and cost
Solution Approach 1:
The patent divides the circuit board into multiple independent layers: a substrate layer, a first circuit layer with circuit modules, and a second circuit layer with signal transmission lines. This segmentation allows each layer to be optimized independently, reducing the complexity of routing high-density signals while maintaining high display resolution.
Solution Approach 2:
The patent transitions from a conventional single-layer or dual-layer board to a multi-layered three-dimensional structure. By adding vertical dimension with multiple circuit layers stacked above the substrate, the design accommodates high-density LED arrangements without proportionally increasing the planar footprint, thus managing complexity more effectively.
2Measurement precision
If the circuit board is fabricated with multi-layered structure to cope with high density LED settings, then the display resolution is improved, but the manufacturing difficulty and cost are increased
Solution Approach 1:
The manufacturing process is segmented into distinct stages: substrate preparation, first circuit layer fabrication with modules, second circuit layer addition with signal lines, and final LED assembly. This segmentation allows each manufacturing step to be optimized and performed by specialized processes, reducing overall manufacturing difficulty despite the multi-layered structure.
Solution Approach 2:
The substrate and first circuit layer with circuit modules are prepared and assembled before adding the second circuit layer. This preliminary action allows the heavy circuit modules to be positioned and secured early in the process, simplifying subsequent steps and reducing manufacturing complexity.
3Measurement precision
If the number of output pins and input pins is increased to support high density LED and circuit module arrangement, then the display resolution is improved, but the circuit layout becomes more complicated
Solution Approach 1:
The patent uses multiple circuit layers stacked vertically to provide additional routing dimensions. Instead of routing all signals in a single plane which would require excessive pins and complex layouts, the design distributes signals across multiple layers, reducing the number of pins needed on each layer and simplifying the overall circuit layout.
Solution Approach 2:
The patent introduces intermediate signal transmission lines on the second circuit layer that act as mediators between the circuit modules on the first layer and the LED connections. These intermediate lines organize and manage signal flow, reducing the complexity of direct connections and minimizing the number of required pins.
Data Source
AI summary
A display device includes a carrier, a substrate unit, a plurality of light emitting elements and a circuit unit. The carrier has a top surface and a bottom surface opposite to each other, and a peripheral surface interconnecting the top and bottom surfaces. The substrate unit is disposed on one side of the peripheral surface of the carrier. The light emitting elements are spacedly disposed on the top surface of the carrier. The circuit unit includes a plurality of circuit modules that are disposed on the substrate unit and that are electrically connected to the light emitting elements. Each of the circuit modules includes a switch control circuit and a driving circuit that are configured to control the light emitting elements.