Display Carrier Structure for Thermal Expansion Mismatch
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Solution Overview
Problem
Display devices face structural strength issues due to inadequate connection between multiple films, layers, and elements, which fails to meet consumer expectations in terms of quality and functionality.
Innovation Solution
A display device design that includes a substrate with light-emitting elements, a back plate, and a carrier with carefully matched thermal expansion coefficients, where the carrier is positioned between the substrate and the back plate to reduce deformation and damage from external forces, using materials like stainless steel or Invar to minimize thermal expansion differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple films and layers are connected in display devices, then the device can achieve required functionality, but the structural strength is compromised due to inadequate connection between components
Solution Approach 1:
A carrier is introduced as an intermediary component between the substrate and back plate. This carrier serves as a mediator that strengthens the overall structure while maintaining the multi-layer functionality of the display device. The carrier provides additional structural support without interfering with the functional connections between films and layers.
2Device complexity
If components with different thermal expansion coefficients are assembled together, then the device achieves required structural configuration, but deformation and damage occur due to thermal expansion differences
Solution Approach 1:
The thermal expansion coefficient of the carrier is specifically selected and controlled to be between 3×10^-6/K and 15×10^-6/K, which is lower than both the substrate (20×10^-6/K to 50×10^-6/K) and back plate (10×10^-6/K to 30×10^-6/K). This parameter optimization reduces thermal expansion differences and minimizes deformation under thermal stress.
Solution Approach 2:
The patent explicitly addresses thermal expansion by selecting materials with appropriate thermal expansion coefficients. The carrier's thermal expansion coefficient is chosen to be intermediate between the substrate and back plate, creating a gradient that reduces stress concentration and thermal deformation during temperature changes.
3Strength
If a carrier is added between substrate and back plate, then structural integrity is improved, but device complexity increases
Solution Approach 1:
The carrier performs multiple functions simultaneously: it strengthens the overall structure, reduces thermal expansion stress, and provides a bonding interface between substrate and back plate. By consolidating these functions into a single component, the increase in complexity is minimized while achieving multiple benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the structural integrity and reliability of the display device by reducing the risk of damage from thermal expansion differences, improving the connection between components and enhancing the bonding process, thereby meeting consumer expectations for quality and functionality.
Implementation Method 1
The substrate has a first thermal expansion coefficient... the back plate has a second thermal expansion coefficient... the carrier has a third thermal expansion coefficient... The absolute value of the difference between the third thermal expansion coefficient and the first thermal expansion coefficient is less than or equal to the absolute value of the difference between the third thermal expansion coefficient and the second thermal expansion coefficient
Data Source
AI summary
Display devices are provided. The display device includes a substrate, a plurality of light-emitting elements, a back plate, and a carrier. The substrate has a first thermal expansion coefficient. The plurality of light-emitting elements is disposed on the substrate. The back plate is disposed corresponding to the substrate and has a second thermal expansion coefficient. The carrier is disposed between the substrate and the back plate and has a third thermal expansion coefficient. The absolute value of the difference between the third thermal expansion coefficient and the first thermal expansion coefficient is less than or equal to the absolute value of the difference between the third thermal expansion coefficient and the second thermal expansion coefficient.