Virtual Image Display Heat Dissipation via Exposed Casing
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Solution Overview
Problem
Self-luminous type video devices, such as organic EL panels, face challenges with miniaturization and performance degradation due to increased internal temperature, which affects the weight reduction and image quality of virtual image display apparatuses.
Innovation Solution
Incorporating a heat dissipating structure in the casing portion of the virtual image display apparatus that exposes a side of the video device opposite to the light emission side for heat dissipation, and using a thermal conductive member to conduct heat away from the light emitting portion, allowing for efficient heat dissipation and maintaining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If a self-luminous type video device (organic EL panel) is used to eliminate the separate light source, then weight reduction and miniaturization are achieved, but internal temperature increases causing performance degradation and life shortening
Solution Approach 1:
The patent extracts the light source function from a separate component and integrates it directly into the panel substrate, eliminating the need for a separate backlight unit. This extraction of the light source function enables weight reduction and miniaturization while the integrated structure allows for direct heat dissipation paths from the light emitting portions to the panel substrate and eventually to the external environment through the casing portion.
Solution Approach 2:
The patent introduces a thermal conductive member as an intermediary between the light emitting portions and the casing portion. This mediator efficiently transfers heat from the light emitting portions through the panel substrate to the casing portion, which then dissipates heat to the external environment, thereby controlling the internal temperature of the video device.
2Volume of moving object
If a self-luminous type video device is used, then miniaturization is achieved, but internal temperature increases affecting image quality
Solution Approach 1:
The patent extracts the light source function from a separate component and integrates it directly into the panel substrate, eliminating the need for a separate backlight unit. This extraction of the light source function enables miniaturization while the integrated structure allows for direct heat dissipation paths from the light emitting portions to the panel substrate and eventually to the external environment through the casing portion.
Solution Approach 2:
The patent introduces a thermal conductive member as an intermediary between the light emitting portions and the casing portion. This mediator efficiently transfers heat from the light emitting portions through the panel substrate to the casing portion, which then dissipates heat to the external environment, thereby controlling the internal temperature of the video device.
3Temperature
If heat dissipating structure is added to the casing portion, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent designs the casing portion to serve multiple functions: it provides mechanical protection for the video device, structural support, and heat dissipation. The heat dissipating structure portion of the casing portion acts as an integrated thermal management system that also serves as part of the external housing, eliminating the need for separate cooling components and reducing overall device complexity.
Solution Approach 2:
The patent merges the heat dissipation function with the existing casing portion structure. Instead of adding a separate cooling system, the casing portion is designed with heat dissipating structure portions that directly contact the panel substrate, combining the protective housing and thermal management functions into a single integrated component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables weight reduction and miniaturization of the virtual image display apparatus while preventing performance degradation and life shortening due to temperature increases, ensuring excellent image formation and reliable assembly with high heat dissipation characteristics.
Implementation Method 1
using a thermal conductive member to conduct heat away from the light emitting portion
Implementation Method 2
the casing portion has a heat dissipating structure portion through which a side of the video device opposite to a side thereof where video light is emitted is exposed for heat dissipation
Data Source
AI summary
An image display device is a self-luminous type device including a light emitting portion, and a casing portion of a display device unit has a heat dissipating structure portion through which a part of the image display device is exposed for heat dissipation. In manufacturing the display device unit, when performing simple and reliable assembly while securing a high heat dissipation characteristic, for example, by using characteristics of a silicon substrate, high accurate positioning is performed in a display device positioning portion.