Display-Equipped Chassis Air Guide Structure for Thermal Separation

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Solution Overview

Problem

Existing computer hosts face issues with insufficient heat dissipation due to the installation of display devices, which generate heat, and hardware instability due to horizontal placement and gravity, leading to potential damage and blocked heat dissipation channels.

Innovation Solution

A chassis structure with a base, casing, top cover, display device, and air guide plate, featuring multiple fan sets and distinct flow and heat dissipation spaces, along with positioning structures and heat dissipation holes, to efficiently dissipate heat and stabilize hardware components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a display device is installed in the chassis, then the functionality and versatility of the system is improved, but the internal heat dissipation becomes insufficient due to additional heat generation

Engineering Contradiction:
ImprovefunctionalityVSAvoidinternal heat dissipation
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent divides the chassis internal space into distinct heat dissipation zones using partition walls and air guide plates. The display device is positioned in a dedicated region with its own heat dissipation path, separated from other heat-generating components. This segmentation allows independent thermal management for each component, preventing heat accumulation while maintaining all functionalities.

Inventive Principle:
Principle #1Segmentation

2Device complexity

If hardware components are arranged horizontally to save space, then the device complexity is reduced, but the hardware stability deteriorates due to gravity affecting tilted components

Engineering Contradiction:
Improvehardware arrangementVSAvoidhardware stability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent transitions from horizontal mounting to vertical mounting of key hardware components such as graphics cards and display devices. By utilizing the vertical dimension within the chassis, the system maintains compact footprint while ensuring components are perpendicular to the motherboard, eliminating gravity-induced tilting and contact issues. The vertical orientation also aligns with natural convection currents for improved passive heat dissipation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If hardware is arranged horizontally, then space is saved, but the heat dissipation channels are blocked which is not conducive to internal air ducts

Engineering Contradiction:
Improvespace utilizationVSAvoidheat dissipation efficiency
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent implements dynamic air flow paths with multiple intake and exhaust positions strategically placed throughout the chassis. The air guide plates and ventilation channels are designed to adapt to the vertical component arrangement, creating unobstructed airflow corridors that follow the natural convection patterns. This dynamic design ensures efficient heat removal while accommodating the vertical hardware configuration.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances heat dissipation by separating heat sources into dissipation spaces, stabilizes hardware components, and prevents blockage, ensuring effective cooling and maintaining component integrity.

Implementation Method 1

each fan inside the chassis can extract the heat source in the flow space to the heat dissipation space for discharge and cooling

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

a heat dissipation space formed between the main body and the heat dissipation side panel

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

the display device will also generate heat energy through operation

Methodology Applied
Scientific EffectThermal Radiation: Thermal Radiation

Data Source

PatentUS20250338430A1Display device-equipped chassis structure
Publication Date: 2025.10.30 HYTE CORP
  • US20250338430A1 patent drawing
  • US20250338430A1 patent drawing
  • US20250338430A1 patent drawing

AI summary

A display device-equipped chassis structure includes a base assembled with a first fan set, a casing positioned on the base and peripherally provided with two side panels, a heat dissipation side panel and a back panel, a top cover assembled on the casing and provided with a second fan set at the bottom thereof, a display device assembled on mounting portions of the base, and an air guide plate with the main body set on the base between the display device and the heat dissipation side panel to define a flow space between the main body and the display device and a heat dissipation space between the main body and the heat dissipation side panel. The air guide plate distinguishes the flow space and the heat dissipation space and cooperates with each fan set for efficient heat dissipation to achieve the cooling effect inside the chassis.