Display Chassis Module Assembly With Conductive Coupling Layers
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Solution Overview
Problem
Existing display device manufacturing processes are inefficient and complex, requiring improvements in process performance and simplification.
Innovation Solution
A manufacturing method involving a display layer with a light emitting element, a first coupling layer, a chassis module, and a chip-on-film, utilizing vacuum pick-up or electromagnet movement, and coupling layers to streamline assembly, including a conductive and non-conductive resin material for electrical connections and structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manufacturing processes are used, then assembly steps are detailed and complex, but process performance is poor and productivity is low
Solution Approach 1:
The patent combines the chassis and chip-on-film into a single integrated chassis module that is moved and disposed as one unit. This merging of components simplifies the manufacturing process by reducing the number of separate assembly steps while improving process performance through streamlined operations.
Solution Approach 2:
The coupling layer serves multiple functions simultaneously: it provides electrical connection between the display layer and chip-on-film, provides structural adhesion to bond components together, and enables the integrated chassis module to be moved as a single unit. This multi-functionality reduces process complexity while enhancing productivity.
2Weight of moving object
If traditional assembly methods are used, then multiple separate components are assembled, but this increases device weight and manufacturing cost
Solution Approach 1:
By integrating the chassis and chip-on-film into a single module with shared support structures, the patent reduces the total number of discrete components. This merging eliminates redundant materials and reduces overall device weight while lowering manufacturing costs through simplified assembly processes.
Solution Approach 2:
The coupling layer is implemented as a thin film structure that provides both electrical and structural functions. This thin-film approach minimizes the weight contribution of interconnection structures while maintaining manufacturing simplicity and cost-effectiveness.
3Strength
If thick coupling layers are used for structural support, then structural strength is sufficient, but device thickness and weight increase
Solution Approach 1:
The coupling layer is designed as a composite structure combining conductive material for electrical connection with resin material for structural support. This composite approach allows the layer to provide both functions simultaneously with minimized thickness, achieving sufficient structural strength without increasing device dimensions or weight.
Solution Approach 2:
The coupling layer employs different material properties in different regions: conductive material is concentrated where electrical connection is needed, while resin material provides structural support. This localized quality distribution enables the layer to achieve both electrical and structural functions with minimal overall thickness.
4Reliability
If separate assembly steps are used for chassis and chip-on-film, then each component can be optimized, but process complexity and time increase
Solution Approach 1:
The chassis and chip-on-film are pre-integrated into a single chassis module before the display assembly process. This preliminary integration allows both components to be optimized independently while reducing assembly time, as the module is then moved and disposed as one unit in a single step.
Solution Approach 2:
By combining the chassis and chip-on-film into an integrated module, the patent maintains the ability to optimize each component separately during module fabrication, while significantly reducing assembly time through simplified downstream processing that treats the module as a single unit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances process performance, reduces complexity, and minimizes weight and cost while maintaining aesthetic appeal by using a plate-shaped chassis with a thin, conductive coupling layer for electrical connections and a non-conductive layer for structural support.
Implementation Method 1
The chassis module may be moved by using a vacuum pick-up method or an electromagnet
Implementation Method 2
The chassis module may be moved by using a vacuum pick-up method or an electromagnet
Implementation Method 3
The first coupling layer may include a conductive material and a resin material
Implementation Method 4
The disposing of the chassis module on the first coupling layer may include curing the first coupling layer and the second coupling layer
Data Source
AI summary
A method for manufacturing a display device includes providing a display layer including a light emitting element; providing a first coupling layer on the display layer; providing a chassis module including a chassis, a second coupling layer, and a chip-on-film; moving the chassis module; and disposing the chassis module on the first coupling layer.