Display Chip Bump Layout to Prevent Substrate Cracking
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Solution Overview
Problem
Direct mounting of drive circuit chips on substrates, especially in flexible display devices, is prone to cracks and damage due to pressure and temperature factors, leading to electrical connectivity issues.
Innovation Solution
The use of conductive pads and bumps arranged in a zigzag pattern on the substrate, with the bumps shifted in a column direction to reduce pressure and prevent damage during the mounting process, ensuring secure electrical connection without cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If drive circuit chip is directly mounted on substrate using COG or TAB method, then integration degree is improved, but pads and wirings are cracked or broken due to pressure and temperature
Solution Approach 1:
The patent transitions from traditional 2D planar mounting (COG/TAB methods) to a 3D stacked architecture where drive circuit chips are vertically mounted on substrate edges. This dimensional change enables direct mounting with improved integration while distributing mechanical stress through vertical stacking rather than lateral expansion, reducing pad and wiring damage.
Solution Approach 2:
The patent segments the drive circuit chip into multiple smaller chips that can be individually mounted on substrate edges. This segmentation reduces the overall mounting area, minimizes thermal and mechanical stress concentration, and allows for more reliable electrical connections compared to mounting a single large chip using traditional COG or TAB methods.
2Adaptability or versatility
If drive circuit chip is directly mounted on substrate edge, then integration degree is improved, but pads and wirings are more prone to cracking due to pressure and temperature
Solution Approach 1:
By mounting drive circuit chips vertically on substrate edges rather than planarly on the substrate surface, the patent reduces the thermal and mechanical stress area. This 3D arrangement improves integration while minimizing exposure to harmful pressure and temperature factors that cause cracking.
Solution Approach 2:
The patent applies different mounting strategies to different locations: drive circuit chips are mounted on substrate edges rather than the central display area. This local differentiation allows direct mounting with improved integration while protecting the main substrate area from stress concentration and cracking.
3Volume of moving object
If flexible substrate is used for compact display device, then device compactness is improved, but mounting reliability deteriorates due to pressure and temperature during mounting process
Solution Approach 1:
The patent uses vertical edge mounting of drive circuit chips on flexible substrates, transitioning from 2D planar integration to 3D stacked architecture. This dimensional change enables compact flexible display devices while improving mounting reliability by reducing stress on the flexible substrate during the mounting process.
Data Source
AI summary
A display device includes a substrate, conductive pads arranged on the substrate over a plurality of rows, and a drive circuit chip including bumps arranged over a plurality of rows to be electrically connected with the conductive pads, and the conductive pads arranged in a same row are arranged in parallel, and the bumps arranged in a same row are arranged in a zigzag form so as to be partially shifted.