Display Substrate Layout for Chip Protection and Heat Dissipation

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Solution Overview

Problem

In display devices with chip-on-chip mounting, the bonding region of a translucent sheet and the driving circuit chip are separate, leading to increased peripheral space and susceptibility to external stress, causing poor conduction and heat radiation issues that degrade image or display quality.

Innovation Solution

A semiconductor device design featuring an element substrate with a resin layer between the opposed substrate and the peripheral region, where the driving circuit chip is positioned further away from the resin layer, allowing for efficient heat radiation and protection from external damage while minimizing peripheral space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If chip-on-chip mounting is adopted to improve processing speed, then the display device achieves higher integration, but the bonding region and mounting region must be separately provided, increasing peripheral space and making the joint part susceptible to external stress

Engineering Contradiction:

Improveprocessing speedVSAvoidjoint part damage resistance

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent merges the bonding region and mounting region by allowing the translucent sheet to extend over the driving circuit chip, creating an integrated structure where both functions coexist in the same spatial area rather than requiring separate regions

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If the translucent sheet and driving circuit chip are separately bonded, then the mounting region can be provided, but the peripheral space becomes large and the joint part is vulnerable to external stress

Engineering Contradiction:

Improvemounting region provisionVSAvoidperipheral space

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The translucent sheet is designed to extend from the bonding region over the driving circuit chip, merging previously separate functional regions into a continuous structure that reduces peripheral space requirements

Inventive Principle:

Principle #5Merging (Combining)

3Volume of moving object

If the driving circuit chip is accommodated in the space surrounded by the element substrate and translucent sheet, then the structure is compact, but heat generated at the driving circuit chip is trapped and cannot be radiated efficiently

Engineering Contradiction:

Improvedevice compactnessVSAvoidheat radiation efficiency

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The translucent sheet acts as a flexible covering that can be configured to either enclose or expose the driving circuit chip, allowing heat to be radiated through the translucent sheet material while maintaining a compact structure

Inventive Principle:

Principle #30Flexible shells and thin films

4Area of stationary object

If the driving circuit chip is positioned close to the resin layer for compact design, then space is optimized, but the chip is more susceptible to external stress and damage

Engineering Contradiction:

Improveperipheral space utilizationVSAvoidexternal stress susceptibility

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The resin layer is positioned between the translucent sheet and the driving circuit chip to provide protective cushioning against external stress, while the translucent sheet extends to provide additional mechanical support and stress distribution

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the reliability and quality of the semiconductor device by reducing damage to the driving circuit chip, improving heat radiation, and optimizing space usage, thereby maintaining image or display quality.

Implementation Method 1

a resin layer arranged between the opposed substrate and the second region, and for bonding the opposed substrate and the second region

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

the heat generated at the driving circuit chip is less likely to be radiated

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS20230309361A1Semiconductor device, display device, photoelectric conversion device, electronic equipment, illuminating device, and mobile object

Publication Date: 2023.09.28 CANON KK

AI summary

A semiconductor device has an element substrate having a first region provided with a functional element provided, and a second region of a peripheral region in a periphery of the first region; an opposed substrate arranged so as to be superposed on at least a part of the second region and the first region in a plan view; a resin layer arranged between the opposed substrate and the second region, and for bonding the opposed substrate and the second region; and a driving circuit chip joined with the second region. The driving circuit chip has a region superposed on the opposed substrate in the plan view, and the driving circuit chip has a region separated from the first region by a longer distance than a distance between the first region and the resin layer, and not superposed on the resin layer in the plan view.