Display Module Chip Layout for Small-Pitch Color Uniformity
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Solution Overview
Problem
Current LED display modules with scattered light-emitting chip arrangements and varying light emission angles result in impure display effects, particularly in small pitch products.
Innovation Solution
A display module with light-emitting chips arranged in a non-collinear configuration, where the projections of the chips overlap in at least two perpendicular directions, and a method involving exposure dissolving glue and colloids to enhance light emission and uniformity, including the use of optical glue and a polarizer for improved ink color consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light-emitting chips are arranged in scattered positions with horizontal or vertical in-line arrangement, then manufacturing is simpler, but light emission angles differ significantly resulting in impure display effects
Solution Approach 1:
The patent applies asymmetry by arranging light-emitting chips in a non-collinear triangular configuration rather than traditional horizontal or vertical in-line arrangements. This asymmetric spatial distribution optimizes light emission angles and improves display effect purity while maintaining manufacturing feasibility.
Solution Approach 2:
The patent transitions from one-dimensional in-line arrangements to two-dimensional triangular configurations. By adding spatial dimensionality and arranging chips at non-collinear positions, the solution achieves better light mixing and emission angle consistency, resolving the contradiction between manufacturing simplicity and display purity.
2Temperature
If light-emitting chips are positioned farther apart, then heat dissipation is improved, but light-mixing distance increases resulting in reduced uniformity
Solution Approach 1:
The patent introduces optical glue with curved surface conforming to the chip geometry, creating a spheroidal optical path. This curved interface optimizes light transmission and mixing while maintaining appropriate chip spacing for heat dissipation, thereby improving both thermal management and light emission uniformity.
Solution Approach 2:
The patent changes the refractive index parameter by introducing optical glue between chips and between chips and the substrate. This parameter modification enhances light coupling efficiency and reduces total internal reflection, allowing chips to be positioned at optimal spacing that balances heat dissipation with light mixing requirements.
3Manufacturing precision
If exposure dissolving glue is applied to cover light-emitting chips, then ink color consistency is improved, but additional manufacturing steps are required
Solution Approach 1:
The patent applies exposure dissolving glue as a preliminary layer before final encapsulation. This preliminary action ensures uniform ink color coverage on chip surfaces that will be exposed, while the glue's photodegradable property allows selective removal to reveal consistent coloring without requiring complex post-processing steps.
Solution Approach 2:
The patent replaces mechanical masking or painting methods with a chemical-photographic system using exposure dissolving glue. The glue is applied uniformly and then selectively dissolved through light exposure, substituting complex mechanical alignment and application processes with a simpler photodegradation mechanism that achieves precise ink color consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light emission effects and uniformity by concentrating light-emitting chip positions, reducing light-mixing distance, and achieving consistent ink color coverage, thereby enhancing display quality.
Implementation Method 1
each of the pixel units is provided with at least three light-emitting chips
Implementation Method 2
lighting up the first light-emitting chips, and dissolving the exposure dissolving glue at the corresponding positions of the first light-emitting chips
Data Source
AI summary
A display module includes a substrate, a plurality of pixel units are arrayed on the substrate, and each of the pixel units is provided with at least three light-emitting chips, and the centers of at least three light-emitting chips are not collinear; and the projections of at least three light-emitting chips along a first direction at least partially overlap, and the projections of at least three light-emitting chips along a second direction at least partially overlap where the first direction is perpendicular to the second direction. In at least one embodiment, there is a method for manufacturing the display module, since the centers of the light-emitting chips are not collinear, that is, a plurality of light-emitting chips are not arranged in a straight line, and the projections of the plurality of the light-emitting chips partially overlap in at least two directions, the positions of the plurality of the light-emitting chips are more concentrated, which can effectively improve the light emission effect of the light-emitting chips.