Display Apparatus Driving Chip Package Spaced Terminals
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Solution Overview
Problem
Display apparatuses face challenges in minimizing the non-display region, which affects the bezel width and reliability due to the need for bending the printed circuit board to connect with the substrate, leading to potential cracking and reduced alignment accuracy.
Innovation Solution
A display apparatus design featuring a driving chip package with spaced terminals and a mold structure that covers the chip and wirings, allowing the printed circuit board to be connected without bending, thereby reducing the non-display region and enhancing reliability by eliminating the need for a separate bending area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the printed circuit board is bent to connect with the substrate, then the connection between the printed circuit board and substrate is achieved, but cracking occurs in the wiring and reliability is reduced
Solution Approach 1:
The patent transitions from a planar connection (bending the printed circuit board in 2D) to a three-dimensional connection structure. The driving chip package extends in the thickness direction of the substrate, with terminals positioned at different heights. This vertical dimensionality allows the printed circuit board to connect directly to the substrate without bending, eliminating wiring stress and cracking while maintaining reliable electrical connection.
2Area of stationary object
If the printed circuit board is bent to connect with the substrate, then the connection is achieved, but the non-display region increases and bezel width is enlarged
Solution Approach 1:
The invention utilizes the thickness direction (vertical dimension) of the substrate to position the driving chip package and its terminals. By extending the connection structure vertically rather than horizontally, the patent eliminates the need for a large non-display region or bending area, thereby reducing bezel width while maintaining connection functionality.
3Manufacturing precision
If the printed circuit board is bent to connect with the substrate, then the connection is achieved, but alignment accuracy is reduced
Solution Approach 1:
The patent employs a three-dimensional connection architecture where the driving chip package extends vertically from the substrate surface. The first terminal connects to the substrate at one height level, while the second terminal connects to the printed circuit board at another height level. This vertical separation simplifies alignment requirements compared to bending, as direct vertical connections are easier to align accurately during manufacturing.
Data Source
AI summary
A display apparatus includes a display panel, a printed circuit board, and a driving chip package. The driving chip package includes a first terminal electrically connected to the display panel, a second terminal electrically connected to the printed circuit board, and a driving chip mounted on the display panel. One end of a first surface of the driving chip package on which the first terminal is arranged and one end of a second surface of the driving chip package on which the second terminal is arranged are spaced from each other in a thickness direction of the display panel.