Display Device Circuit Board EMI Dissipation via Conductive Structure
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Solution Overview
Problem
Display devices face electromagnetic interference issues due to power management circuits radiating electromagnetic waves, which affect signal transmission leads and electronic components on the circuit board, leading to noise and interference.
Innovation Solution
A display device design featuring a light emitting module with a conductive portion, a circuit board with an exposed external conductive layer electrically coupled to a ground wire, and a conductive structure between the circuit board and light emitting module, allowing for efficient dissipation of electromagnetic interference through the conductive portion, reducing noise and ensuring compliance with electromagnetic interference control standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power management circuits are used to provide power and data signals to light emitting modules, then the light emitting modules can be driven to display, but electromagnetic interference is generated that affects signal transmission leads and electronic components on the circuit board
Solution Approach 1:
The patent extracts the electromagnetic interference problem by separating the harmful electromagnetic waves from the functional power management circuits. An external conductive layer is introduced to capture and channel the electromagnetic interference away from sensitive signal transmission leads and electronic components, effectively removing the harmful effect while preserving the power management function.
Solution Approach 2:
The patent introduces an external conductive layer as an intermediary element between the power management circuits and the sensitive components. This conductive layer acts as a mediator that intercepts electromagnetic interference and provides a controlled path for its dissipation, preventing direct interference with signal transmission leads and electronic components.
2Reliability
If an external conductive layer is added to the circuit board to dissipate electromagnetic interference, then electromagnetic interference control standards can be met, but the device complexity increases
Solution Approach 1:
The patent merges the external conductive layer with the existing circuit board structure, integrating the electromagnetic interference dissipation function into the overall board design. The conductive layer is combined with ground wires and existing circuit board layers, creating a unified structure that achieves EMI control without requiring completely separate additional components.
Solution Approach 2:
The external conductive layer is designed to serve multiple functions: it provides electromagnetic interference dissipation, establishes electrical connection with ground wires, and integrates with the existing circuit board structure. This multi-functionality reduces the need for separate dedicated EMI shielding components, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates electromagnetic interference, ensuring normal operation of the light emitting module and compliance with electromagnetic interference control standards, thereby improving the reliability and performance of the display device.
Implementation Method 1
a conductive structure, located between the circuit board and the light emitting module, and enabling the external conductive layer to be electrically coupled to the conductive portion
Data Source
AI summary
The present disclosure is related to a display device and a circuit board (200). The display device comprises a light-emitting module (100), a circuit board (200) and a conductive structure (300). The surface of the light-emitting module (100) is provided with a conductive portion (101). The circuit board (200) is arranged on a back face (102) of the light-emitting module (100), and has a first surface (201) close to the light-emitting module (100). The first surface (201) of the circuit board (200) is provided with an exposed external conductive layer (210), and the external conductive layer (210) is electrically connected to a ground wire of the circuit board (200). The conductive structure (300) is located between the circuit board (200) and the light-emitting module (100), and makes the external conductive layer (210) electrically connect to the conductive portion (101).