Peripheral Shielding Layout for ESD-Resistant Display Circuits
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Solution Overview
Problem
Display devices face challenges in minimizing the impact of external electrostatic discharge on peripheral circuits and signal interference between scan driving circuits and input sensors, leading to potential damage and reduced accuracy.
Innovation Solution
Incorporating a first and second shielding layer with holes that overlap each other, positioned between the peripheral circuit and signal lines, and connected to power voltage wiring, to prevent electrostatic discharge and signal interference, while maintaining a reduced peripheral area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shielding layers are added to protect peripheral circuits from electrostatic discharge and signal interference, then reliability is improved, but device complexity increases
Solution Approach 1:
The shielding structure is divided into multiple layers (first shielding layer and second shielding layer) with different configurations. Each layer serves specific protection functions, allowing the system to address multiple interference sources separately rather than using a single complex shielding structure
Solution Approach 2:
The first and second shielding layers are nested vertically above the peripheral circuit, creating a multi-level protective structure. This nested arrangement provides comprehensive shielding while maintaining a compact footprint that doesn't significantly increase the overall device area
2Reliability
If shielding layers are added to minimize signal interference, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The shielding function is segmented into multiple layers that can be fabricated using standard thin-film deposition processes. Each layer is patterned separately, allowing for precise control of shielding characteristics while utilizing existing manufacturing capabilities
Solution Approach 2:
Instead of increasing shielding effectiveness by making a single layer thicker (which would be difficult to manufacture), the solution adds vertical layers at different heights above the circuit. This dimensional approach achieves better shielding while remaining compatible with standard multi-layer thin-film fabrication processes
3Productivity
If peripheral area is reduced to increase display area, then productivity is improved, but susceptibility to electrostatic discharge increases
Solution Approach 1:
The shielding layers extend vertically above the peripheral circuit rather than expanding horizontally. This allows the display area to be maximized in the planar direction while protection is provided in the vertical dimension, effectively decoupling display area from protection capability
Solution Approach 2:
The shielding structure uses composite material layers (such as metal layers combined with dielectric materials) that provide both electrostatic protection and space efficiency. This allows adequate shielding performance within a compact peripheral area that doesn't significantly reduce the display region
Data Source
AI summary
A display device includes a substrate that includes a display area and a peripheral area outside the display area, a display element on the display area, a peripheral circuit on the peripheral area, the peripheral circuit including a thin film transistor, a first shielding layer on the peripheral circuit. and a second shielding layer on the first shielding layer. At least one of the first shielding layer and the second shielding layer includes a hole. One shielding layer of the first shielding layer and the second shielding layer includes the hole and overlaps the other one of the first shielding layer and the second shielding layer.