Display Substrate Circuit Layout for Uniform Brightness
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Solution Overview
Problem
The excessive gathering of signal lines and power lines on one side of a substrate in electronic devices leads to uneven current distribution, heat accumulation, and power dissipation, affecting the quality of displayed images, such as causing uneven image brightness.
Innovation Solution
The electronic device features a circuit layer with alternating first and second wirings on opposite surfaces of a substrate, where the second wirings are disposed on the first wirings, allowing for more uniform signal distribution and reducing heat accumulation by dispersing power signals across multiple terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If signal lines and power lines are arranged on the same side of the substrate to save space, then space utilization is improved, but current distribution uniformity deteriorates and heat accumulation increases
Solution Approach 1:
The patent transitions from a two-dimensional arrangement where all wiring is on one side of the substrate to a three-dimensional configuration utilizing both sides of the substrate. The circuit layer is divided into a first layer and a second layer disposed on opposite sides, with wirings extending through the substrate. This dimensional change allows for better current distribution and heat dissipation while maintaining space efficiency.
Solution Approach 2:
The circuit layer is segmented into multiple layers (first layer and second layer) positioned on opposite sides of the substrate. Each layer contains specific wirings that are electrically connected through conductive structures penetrating the substrate. This segmentation distributes the current load across multiple pathways and reduces heat accumulation in any single location.
2Area of stationary object
If signal lines and power lines are arranged on the same side of the substrate to save space, then space utilization is improved, but heat dissipation deteriorates
Solution Approach 1:
By distributing wirings across both sides of the substrate and creating a multi-layer circuit structure, the patent increases the surface area available for heat dissipation. The wirings on opposite sides act as separate heat dissipation pathways, reducing thermal accumulation that would occur with concentrated wiring on a single side.
Solution Approach 2:
The circuit layer is divided into multiple segments across different layers and sides of the substrate. This segmentation distributes heat generation and dissipation across multiple locations, preventing localized heat accumulation and improving overall thermal management of the device.
3Device complexity
If wiring is concentrated on one side of the substrate, then manufacturing complexity is reduced, but image display quality deteriorates due to uneven brightness
Solution Approach 1:
The patent employs a multi-layer circuit structure with wirings on both sides of the substrate, creating more uniform current distribution across the display area. This results in more uniform brightness distribution in the displayed image, eliminating the brightness non-uniformity caused by concentrated wiring on one side.
Solution Approach 2:
Different regions of the substrate have different wiring configurations optimized for their specific functions. The first layer and second layer contain different wiring patterns and types (signal lines, power lines) that are locally optimized to achieve uniform current distribution and brightness across the entire display area while maintaining manufacturing feasibility.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate, a light-emitting unit, and a circuit layer. The substrate has a first surface and a second surface, and the second surface is opposite the first surface. The light-emitting unit is disposed on the first surface, and the circuit layer is disposed on the second surface. The circuit layer includes a first layer and a second layer. The second layer is disposed on the first layer. The first layer includes a plurality of first wirings. The second layer includes a plurality of second wirings. The plurality of first wirings intersect with the plurality of second wirings.