Display Electrode Layout Using CMP Height Compensation

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Solution Overview

Problem

Current display device manufacturing processes face challenges in achieving a stable and efficient formation of contact electrodes, particularly due to limitations in the precision and margin of error in chemical mechanical polishing (CMP) techniques, which affect the alignment and separation of electrodes and light-emitting elements.

Innovation Solution

The proposed solution involves a display device design with a substrate having an emission area and a subarea, featuring a bank and a height difference compensation pattern, where contact electrodes are formed using CMP, with specific insulating layers and materials like silicon nitride and silicon oxide, and a photoresist pattern formed by CMP to accurately divide the contact electrode material layer into spaced-apart electrodes without additional mask processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If chemical mechanical polishing (CMP) is used to form contact electrodes, then manufacturing efficiency is improved, but manufacturing precision deteriorates due to limitations in CMP precision and process margin

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidcontact electrode alignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent introduces a height difference compensation pattern as an intermediary element between the bank and the contact electrodes. This compensation pattern creates a controlled height difference that serves as a physical reference for aligning contact electrodes of different colors, thereby improving manufacturing precision without sacrificing the manufacturing efficiency gains from CMP processing

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the height parameter by creating a height difference compensation pattern with a specific height difference (first height difference and second height difference). This parameter change provides a physical reference that compensates for CMP process variations, enabling better alignment precision while maintaining the efficiency of CMP-based contact electrode formation

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If additional mask processes are used to form photoresist patterns for dividing contact electrode material layer, then manufacturing precision is improved, but device complexity and manufacturing time increase

Engineering Contradiction:
Improvecontact electrode separation precisionVSAvoidfabrication process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent performs preliminary action by pre-forming the height difference compensation pattern before depositing the contact electrode material layer. This pre-established height reference enables direct patterning of the contact electrode material layer without requiring additional mask processes, thereby reducing fabrication process complexity while maintaining precision

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent extracts and eliminates the additional mask process step from the fabrication sequence. By utilizing the height difference compensation pattern as a self-aligned reference, the method removes the need for separate mask alignment and patterning steps, simplifying the overall device fabrication process

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the process margin for forming contact electrodes, improves manufacturing efficiency, and allows for precise alignment without additional mask processes, leading to improved display device performance and reliability.

Implementation Method 1

forming the contact electrodes via chemical mechanical polishing (CMP)

Methodology Applied
Scientific EffectChemical mechanical polishing:

Data Source

PatentUS12170272B2Display device and method of fabricating the same
Publication Date: 2024.12.17 SAMSUNG DISPLAY CO LTD
  • US12170272B2 patent drawing
  • US12170272B2 patent drawing
  • US12170272B2 patent drawing

AI summary

A display device and a method of fabricating a display device. The display device includes a substrate including an emission area and a subarea adjacent to the emission area, a bank disposed in the emission area of the substrate, a height difference compensation pattern disposed in the subarea of the substrate, a first electrode and a second electrode that are disposed on the bank, the first electrode and the second electrode being spaced apart from each other, and a light-emitting element disposed in the emission area, between the first electrode and the second electrode.