Display Device Conductive Adhesive for Through-Hole Current Control
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Solution Overview
Problem
Existing display devices face issues with current concentration on through-holes in optical areas, leading to reliability degradation and difficulty in minimizing bezel size due to the need for additional space for current diversion configurations.
Innovation Solution
Incorporation of a conductive first adhesive unit within the adhesive layer to enclose the through-hole, which redirects current to a metal plate, minimizing bezel size and reducing reliability issues by preventing current concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a through-hole is disposed in the optical area to minimize bezel size, then the bezel size is reduced, but current concentration occurs on the through-hole causing reliability degradation
Solution Approach 1:
A conductive adhesive layer is introduced as an intermediary component between the display panel and the case. This adhesive layer includes a conductive adhesive unit that extends to the through-hole in the optical area, serving as a mediator to redirect current away from the through-hole edge while maintaining the minimized bezel design. The conductive adhesive unit acts as a current diversion path that prevents direct current concentration on the through-hole.
Solution Approach 2:
The electrical conductivity parameter is changed by incorporating a conductive adhesive unit into the adhesive layer. This conductive adhesive unit has different electrical properties compared to the non-conductive adhesive layer, enabling it to modify current distribution patterns. By changing the conductivity parameter in the adhesive layer, current is redirected away from the through-hole edge, preventing concentration while maintaining the structural integrity of the minimized bezel design.
2Reliability
If additional space is allocated for current diversion configurations, then current concentration is prevented, but the bezel size increases
Solution Approach 1:
The current diversion function is merged with the adhesive layer that already exists in the display device structure. Instead of adding a separate current diversion component that would increase bezel size, the conductive adhesive unit is integrated into the existing adhesive layer, combining the bonding function with the current diversion function. This merging approach allows current concentration prevention without requiring additional space that would increase the bezel.
Solution Approach 2:
The adhesive layer is given multiple functions: it continues to serve as the bonding layer between the display panel and case, while simultaneously serving as a current diversion path through the conductive adhesive unit. This multi-functionality allows the same structural component to address both bonding requirements and current concentration prevention, eliminating the need for separate current diversion structures that would increase bezel size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances display device reliability by redirecting current away from through-holes, allowing for a narrower bezel and improved image quality by reducing external light reflection.
Implementation Method 1
a first adhesive unit which is disposed to enclose the through-hole and has a conductivity
Data Source
AI summary
According to an aspect of the present disclosure, a display device includes a cover window; a display panel which is disposed below the cover window and includes a display area in which a plurality of sub pixels is disposed and an optical area which is disposed between the plurality of sub pixels in the display area and has a through-hole disposed therein; an adhesive layer which is disposed below the display panel and includes a first adhesive unit which is disposed to enclose the through-hole and has a conductivity and a second adhesive unit which encloses the first adhesive unit; and a metal plate disposed below the adhesive layer.