Display Device With Through-Substrate Conductive Particles
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Solution Overview
Problem
Conventional display devices face challenges in reducing the size of the peripheral region and increasing the integration density of pixels, particularly due to limitations in processing precision and the need for precise substrate openings, which complicates the electrical connection between the front and rear surfaces of substrates.
Innovation Solution
A display device structure that includes a first substrate with conductive particles exposed on both surfaces, allowing for electrical connection between lines on the front and rear surfaces via these particles, enabling the reduction of the peripheral region size by integrating thin film transistors and light emitting elements in a way that minimizes the non-display area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate opening technology is used to connect front and rear surface lines, then electrical connection is achieved, but the peripheral region size cannot be reduced and processing precision requirements increase
Solution Approach 1:
The invention transitions from planar connections to three-dimensional vertical connections by forming conductive particles that extend through the substrate thickness direction. This allows electrical connection between front and rear surface lines without requiring large peripheral regions, as the connection path moves from the lateral plane to the vertical dimension.
Solution Approach 2:
The invention introduces conductive particles as an intermediary element embedded within the substrate to facilitate electrical connection between front and rear surface lines. These particles act as a mediator that enables connection through the substrate without requiring direct contact or large peripheral bonding areas.
2Area of stationary object
If substrate openings are made smaller to reduce peripheral region, then peripheral area is reduced, but manufacturing precision requirements increase
Solution Approach 1:
By moving the connection approach from lateral (in-plane) to vertical (through-thickness), the invention allows smaller peripheral openings while maintaining manufacturability. The conductive particles provide a defined vertical path that is easier to control with standard fabrication processes than lateral precision alignment.
Solution Approach 2:
The invention changes the critical dimension parameter from lateral opening size to vertical particle depth and diameter. This parameter transformation allows the peripheral region to be minimized while the conductive particles maintain sufficient size for reliable electrical connection without requiring excessive lateral precision.
3Productivity
If more pixels are integrated to increase display density, then display resolution improves, but peripheral region proportion increases
Solution Approach 1:
The vertical connection approach enables pixels to be arranged more densely in the planar display region without being constrained by large peripheral bonding areas. By moving connections to the vertical dimension, the peripheral region proportion decreases while pixel integration density increases.
4Reliability
If conventional connection methods are used, then electrical connection is established, but device complexity increases
Solution Approach 1:
The invention merges the connection function with the substrate structure itself by embedding conductive particles within the substrate material. This integration eliminates the need for separate connection components or complex bonding structures, reducing overall device complexity while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures reliable electrical connections and reduces the peripheral region size, allowing for higher pixel integration density and efficient use of substrate space, thereby enhancing the display device's performance and miniaturization capabilities.
Implementation Method 1
a resin layer including a conductive particle; a first line connected with the conductive particle on the side of a first surface of the resin layer; and a second line connected with the first line via the conductive particle
Data Source
AI summary
A display device includes a first substrate including a conductive particle provided therein; a first line connected with the first substrate on the side of a first surface of the first substrate; a display element connected with the first line; and a second line connected with the first line via the conductive particle on the side of a second surface of the first substrate.