Display Device Conductive Layer Slit and Cutout Isolation
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Solution Overview
Problem
Existing display devices face issues with leakages between intersecting wiring lines, which can lead to defective display areas, and current methods for isolating these leaks, such as laser cutting, may not effectively eliminate the problem without increasing wiring resistance.
Innovation Solution
A display device design featuring a first and second conductive layer with slit and cutout portions in overlapping sections, allowing for targeted isolation of leaks by cutting off the conductive layer connecting the slit and cutout portions, thereby facilitating repair without significantly increasing resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the length of the slit is increased to isolate larger leak spots, then the ability to repair larger defects is improved, but the wiring resistance increases and display performance degrades
Solution Approach 1:
The conductive layer is divided into multiple segments by forming both slit portions and cutout portions. The slit portions create narrow gaps while the cutout portions remove larger areas, together forming an isolated region that can contain larger leaks without requiring excessively long slits that would increase resistance
Solution Approach 2:
The invention transitions from a single-dimensional slit approach to a two-dimensional isolation pattern combining slits and cutouts. This allows the isolated region to extend in multiple directions, effectively containing larger defects while maintaining shorter overall conductive path lengths and thus lower resistance
2Reliability
If laser cutting is used to isolate leak spots with film residue or foreign substances larger than the slit width, then the leak isolation capability is improved, but the complexity of the cutting operation increases and repair defects may occur at turning points
Solution Approach 1:
The isolation structure is segmented into slit portions and cutout portions, allowing the laser to perform simple linear cuts and directional changes at predetermined locations rather than continuous complex path planning. The cutout portions serve as natural turning points that are easier to manufacture and less prone to defects
Solution Approach 2:
The slit portions and cutout portions are pre-formed in the conductive layer before final isolation is needed. This preliminary structuring allows subsequent laser cutting to simply connect these pre-defined features, greatly simplifying the operation and reducing the risk of repair defects compared to performing complex free-form cutting
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable repair of leaks and defective areas without degrading display performance by allowing for precise cutting operations and reducing the need for lengthy slits, thus maintaining low wiring resistance.
Implementation Method 1
a portion of the conductive layer connecting the slit portion and the cutout portion is cut off by laser radiation
Data Source
AI summary
A liquid crystal device 1 of the present invention includes a first conductive layer 20 and a second conductive layer 21 arranged across an insulating layer from the first conductive layer 20. A crossover section 40 at which the first conductive layer 20 and the second conductive layer 21 intersect each other is provided. At least one of the first conductive layer 20 and the second conductive layer 21 includes a slit portion 210a and a cutout portion 201b, which are arranged in the crossover section 40 so that the cutout portion 210b is at a predetermined distance from the slit portion 210a.