Display Device Connection Module Segmentation for Signal Stability
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Solution Overview
Problem
Existing display devices face issues due to significant size differences between contact points at the ends of connecting lines, leading to increased inclination and inconsistency in signal transmission, as well as a higher likelihood of bond breaking between the connecting line and the circuit board.
Innovation Solution
A display device with a connection module comprising a first connection section and a second connection section, where the ends of the first connection section are connected to specific portions on a first substrate, and the ends of the second connection section are connected to corresponding portions on a second substrate, allowing for overlapping and parallel arrangements to stabilize the connection and ensure consistent signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single connecting line is used to connect substrates of different sizes, then the connection structure is simple, but the connecting line becomes highly inclined and signal transmission becomes inconsistent
Solution Approach 1:
The connecting line is divided into multiple segments (first connecting line and second connecting line) with different inclination angles. The first connecting line connects the first contact point to the second contact point, while the second connecting line connects the third contact point to the fourth contact point. This segmentation allows each segment to have an optimized inclination angle, improving signal transmission consistency while maintaining connection simplicity.
Solution Approach 2:
The connection structure transitions from a single-plane connection to a multi-dimensional arrangement by introducing contact points at different locations and orientations. The first and third contact points are arranged at a first orientation, while the second and fourth contact points are arranged at a second orientation different from the first. This dimensional change enables the connecting lines to accommodate substrate size differences while maintaining consistent signal transmission.
2Adaptability or versatility
If the connecting line spans large distance between substrates, then it can connect different sized substrates, but the bond between connecting line and substrate becomes prone to breaking
Solution Approach 1:
The long connecting line is segmented into multiple shorter sections with intermediate contact points. Instead of having one long bond between the connecting line and substrate, the connection is distributed across multiple shorter bond points (first, second, third, and fourth contact points). This reduces the stress on each individual bond, lowering the risk of bond breaking while maintaining adaptability to different substrate sizes.
Solution Approach 2:
Different sections of the connection structure have different local characteristics. The first connecting line and second connecting line have different inclination angles optimized for their respective locations. The contact points are strategically positioned at different orientations to optimize local bonding conditions. This local optimization ensures strong bonds at each connection point while accommodating overall substrate size variations.
Data Source
AI summary
A display device is disclosed. The display device includes: a first substrate having a first surface and a second surface; a second substrate having a third surface and a fourth surface; and a connection module connected between the first substrate and the second substrate. The connection module further includes: a first connection section having two ends respectively connected to a first connection portion and a second connection portion, wherein the first connection portion is connected to the first surface of the first substrate, and the second connection portion is connected to the third surface of the second substrate; a second connection section having two ends respectively connected to the first connection portion and a third connection portion, wherein the third connection portion is connected to the second substrate.


