Display Panel Connection Structure to Prevent Skip Plating
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Solution Overview
Problem
The wet chemical plating process for forming connection metals in display panels often results in skip plating due to the conductive base material's small specific surface area, leading to reduced plating efficiency and increased risk of short circuits.
Innovation Solution
A chemical plating process is used where the conductive base material is not in contact with the electrode, allowing for isotropic growth of the connection metal to form a stable connection without direct contact, thereby increasing the specific surface area and preventing skip plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the conductive base material is in contact with the electrode during wet chemical plating, then the plating process can be simplified, but skip plating occurs due to small specific surface area
Solution Approach 1:
The conductive base material is segmented into multiple isolated islands rather than a continuous structure. Each island is spatially separated from electrodes and other islands, allowing independent plating on each segment. This segmentation increases the effective specific surface area available for plating and prevents skip plating by ensuring each segment has sufficient surface area for complete metal deposition.
Solution Approach 2:
The conductive base material is positioned in a three-dimensional space away from the electrode plane, creating vertical separation. By forming the base material at a different height level (using insulation layers for elevation), the plating solution can access all surfaces of the base material from multiple directions, effectively increasing the plating surface area and preventing skip plating.
2Productivity
If the conductive base material has small specific surface area, then the structure can be compact, but plating efficiency decreases
Solution Approach 1:
Dividing the base material into multiple small isolated islands increases the total surface area relative to the footprint. The segmented structure allows plating solution to access all surfaces of each island, maximizing the effective plating area within a compact overall structure, thereby improving plating efficiency.
Solution Approach 2:
By elevating the base material islands above the substrate plane using insulation layers, the structure utilizes vertical space to increase surface area. This three-dimensional arrangement allows the plating solution to coat all exposed surfaces of the islands, effectively increasing the specific surface area available for plating without increasing the planar footprint.
3Reliability
If chemical plating is used to form connection metal, then good electrical connection can be achieved, but skip plating may occur affecting yield
Solution Approach 1:
Segmenting the base material into isolated islands ensures that each segment undergoes complete and uniform plating without skip plating. This segmentation approach maintains the electrical connection quality through proper plating while significantly improving manufacturing yield by eliminating the skip plating defect that would otherwise cause panel rejection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the plating efficiency and reliability of the connection metal formation, reducing the risk of short circuits and improving the overall performance of the display panel.
Implementation Method 1
a metal is reduced on a surface of the conductive base material by using a chemical plating solution to form a metal plating layer
Data Source
AI summary
A display panel, a method for manufacturing the display panel, and a display apparatus are provided. The display panel includes: a driving backboard including a substrate, a functional circuit and a first electrode electrically connected with the functional circuit; a connection structure located at a side of the driving backboard, the connection structure includes a first connection portion, and the first connection portion includes a first base material and a first connection metal. The first base material is not in contact with the first electrode, the first connection metal is at least partially located on a surface of the first base material away from the substrate, and the first connection metal is electrically connected to the first electrode.