Display Connection Layout That Avoids Via Overlap
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Solution Overview
Problem
Existing display devices face challenges in achieving improved reliability and efficiency in the electrical connections between conductive layers and light emitting elements, particularly due to overlapping via holes and additional conductive layers that complicate the manufacturing process.
Innovation Solution
A display device design featuring a connection pattern between conductive layers that does not overlap via holes, allowing direct electrical connections through multiple insulating layers, and includes a dummy electrode to enhance reliability and reduce manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection pattern is positioned to overlap via hole, then electrical connection is achieved, but manufacturing complexity and reliability are worsened
Solution Approach 1:
The connection pattern is extracted from the via hole area, positioning it separately to avoid overlap. This separation eliminates the need for precise alignment between the connection pattern and via hole, thereby reducing manufacturing complexity while maintaining electrical connection reliability through the insulating layer structure.
Solution Approach 2:
The insulating layer acts as an intermediary between the connection pattern and the via hole. By positioning the connection pattern on the insulating layer rather than directly overlapping the via hole, the design achieves electrical connection while simplifying the manufacturing process and improving reliability.
2Reliability
If multiple conductive layers and via holes are used for electrical connection, then electrical connectivity is achieved, but the number of manufacturing steps increases
Solution Approach 1:
The insulating layer and connection pattern are merged into a single structural unit where the connection pattern is formed on the insulating layer. This integration reduces the number of separate manufacturing steps while maintaining the electrical connection reliability through the combined structure.
Solution Approach 2:
The insulating layer is formed in advance before positioning the connection pattern. This preliminary action allows the connection pattern to be subsequently placed without requiring precise alignment with via holes, thereby reducing manufacturing steps and improving efficiency while maintaining connection reliability.
3Ease of manufacture
If connection pattern overlaps via hole, then electrical connection path is created, but manufacturing precision requirements increase
Solution Approach 1:
The connection pattern is extracted from the via hole region and positioned on the insulating layer instead. This separation eliminates the alignment precision requirements between the connection pattern and via hole, making the manufacturing process easier and less demanding.
Solution Approach 2:
The electrical connection structure is segmented into distinct functional zones: the via hole for vertical connection and the connection pattern on the insulating layer for horizontal connection. This segmentation allows each component to be manufactured independently with lower precision requirements while achieving the overall connection function.
Data Source
AI summary
A display device includes: a substrate; a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive layer sequentially stacked on the substrate; a transistor on the substrate; a conductive pattern on the transistor, and electrically connected to the transistor, and comprising the third conductive layer; an insulating layer on the conductive pattern and including a first via hole exposing one area of the conductive pattern; a light emitting element on the insulating layer, and electrically connected to the conductive pattern through the first via hole; and a connection pattern between the conductive pattern and the light emitting element, and comprising the fourth conductive layer, wherein the connection pattern does not overlap the first via hole.