Tiled Display Contact Pad Structure for Hidden Module Gaps
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Solution Overview
Problem
Large-sized display devices face increased defect rates of light emitting elements due to the higher number of pixels, leading to reduced productivity and reliability. Additionally, tiled display devices exhibit a sense of disconnection between multiple display units due to visible boundary portions or non-display areas.
Innovation Solution
A tiled display device is designed with a metal pattern on the substrate's surface surrounding contact holes, providing wet etching resistance and acting as a mask during the etching process. This configuration minimizes the gap between display devices by integrating pad units within the display area, preventing recognition of boundary portions or non-display areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a large-sized display device is manufactured with increased number of pixels, then the display area is improved, but the defect rate of light emitting elements increases
Solution Approach 1:
The patent divides the large-sized display device into multiple small-sized display modules that are connected to form a tiled display. Each module contains a manageable number of pixels, avoiding the defect rate increase associated with large-scale pixel arrays while achieving a large overall display area through modular assembly.
2Area of stationary object
If multiple display devices are connected to form a tiled display, then the display area is improved, but boundary portions and non-display areas become visible causing disconnection
Solution Approach 1:
The patent merges adjacent display modules by minimizing the gap between them through optimized pad unit positioning. The pad units are strategically placed within the display area rather than at the edges, allowing modules to be connected with minimal spacing that becomes imperceptible, creating a seamless visual experience.
Solution Approach 2:
The patent relocates pad units from the traditional edge position to positions within the display area, utilizing the internal space dimension. This dimensional repositioning allows the connection structures to be hidden within the display content area, eliminating visible boundaries between modules.
3Ease of manufacture
If pad units are positioned at the edge of the substrate, then electrical connection is simplified, but the gap between display devices increases
Solution Approach 1:
Instead of placing pad units at the conventional edge position of the substrate, the patent inverts this arrangement by positioning them within the display area. This inversion allows the connection structures to be integrated into the active display region, reducing the external gap between modules while maintaining electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the visibility of boundary portions between display devices, enhancing the sense of immersion in images and improving the reliability and productivity of large-sized display devices by minimizing defects.
Implementation Method 1
a metal pattern disposed on another surface opposite to the surface of the substrate and surrounding the first contact hole in a plan view
Data Source
AI summary
A display device includes a substrate including a first contact hole, an etching stopper disposed on a surface of the substrate and including the first contact hole, a metal pattern disposed on another surface opposite to the surface of the substrate and surrounding the first contact hole in a plan view, a first pad unit overlapping a part of the metal pattern and inserted into the first contact hole, a lead line disposed on the another surface of the substrate and electrically connected to another part of the metal pattern, a second pad unit disposed on the another surface of the substrate and electrically connected to the lead line, a protective film overlapping the another surface of the substrate and the lead line, and a protection part overlapping the first pad unit.