Display Surface Cooling Module With Directed Turbulent Airflow
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Solution Overview
Problem
Electronic devices, particularly those used outdoors, face challenges in dissipating heat effectively due to high ambient temperatures, leading to potential overheating and damage.
Innovation Solution
A heat dissipation module is integrated into the electronic device, featuring a casing with openings and fans that direct airflow towards the display surface to dissipate heat, utilizing centrifugal fans with angled outlets and multiple intake points to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional heat dissipation methods are added to prevent overheating, then the reliability of the electronic device is improved, but the device complexity increases
Solution Approach 1:
The heat dissipation module is integrated with the display assembly, combining the cooling function with the existing display structure. The first fan and casing are mounted on the display's outer surface, merging heat dissipation components with the display assembly to avoid adding separate complex structures.
Solution Approach 2:
The heat dissipation system is divided into independent modules: the first fan for active cooling, the second fan in the chassis for additional ventilation, and the casing with specific opening configurations. This segmentation allows each component to be optimized independently while maintaining overall system reliability.
2Productivity
If the heat dissipation module uses multiple fans and openings, then the heat dissipation efficiency is improved, but the manufacturing complexity increases
Solution Approach 1:
The casing serves multiple functions: it houses the first fan, provides structural support, and incorporates both first and second openings for optimized airflow. The display assembly itself serves as the mounting platform for the heat dissipation module, eliminating the need for separate mounting structures and simplifying manufacturing.
Solution Approach 2:
The heat dissipation openings are arranged in different spatial dimensions and orientations (first opening on the outer surface, second opening on the inner surface). This multi-dimensional arrangement maximizes heat dissipation efficiency while allowing independent optimization of each opening's position and size for manufacturing convenience.
3Temperature
If the first fan directs airflow directly to the display surface, then the cooling effect is improved, but the energy consumption increases
Solution Approach 1:
The first opening of the casing is positioned to face the display surface, directing cooled air precisely where it is needed most. This localized cooling approach concentrates the fan's energy output on the critical display surface area rather than dispersing it uniformly, improving cooling efficiency while reducing overall energy consumption.
Solution Approach 2:
The casing acts as an intermediary structure that guides and directs the airflow from the first fan toward the display surface. It includes airflow guiding structures that channel the air efficiently, ensuring that the fan's energy is effectively utilized for cooling the display surface without excessive power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat dissipation module effectively cools the display surface by generating turbulent airflow, improving heat dissipation and preventing overheating.
Implementation Method 1
the first fan includes an air inlet portion and an air outlet portion. The air outlet portion faces the first opening, wherein an airflow generated by the first fan flows out of the casing from the air outlet portion via the first opening to flow to the display surface
Implementation Method 2
The heat dissipation module effectively cools the display surface by generating turbulent airflow, improving heat dissipation and preventing overheating
Implementation Method 3
the second fan is disposed in the chassis... the chassis includes an air inlet and an air outlet, the air outlet is located at an end of the chassis adjacent to the heat dissipation module, and the air inlet is located at another end of the chassis away from the heat dissipation module, wherein an airflow is adapted to flow into the chassis from the air inlet and flow out from the chassis via the air outlet
Data Source
AI summary
An electronic device includes a body and a heat dissipation module. The body includes a display, and the display has a display surface. The heat dissipation module is disposed on the display. The heat dissipation module includes a casing and at least one first fan. The casing has a first opening. The first opening faces the display surface. The first fan is disposed in the casing, and the first fan includes an air inlet portion and an air outlet portion. The air outlet portion faces the first opening, wherein an airflow generated by the first fan flows out of the casing from the air outlet portion via the first opening to flow to the display surface. An ambient air outside the casing flows into the air inlet portion of the first fan via the first opening.