Display Device Corner Strain Reduction via Cut Patterns

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Solution Overview

Problem

Existing display devices face challenges in reliably forming an organic encapsulation layer in cut patterns at corner portions, where high strain due to double curvature occurs, leading to potential damage from moisture or oxygen.

Innovation Solution

The implementation of cut patterns and cut grooves at corner portions of the display device, combined with an organic encapsulation layer and inorganic encapsulation layers, helps reduce strain and ensure reliable coverage of particles, while the inorganic encapsulation layers provide additional protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If cut patterns and cut grooves are formed at corner portions to reduce strain, then the organic encapsulation layer can be reliably formed, but the device structure becomes more complex

Engineering Contradiction:
Improvereliability of organic encapsulation layer formationVSAvoidstructure complexity at corner portions
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The corner portion is divided into multiple separate structures: a first cut pattern extending from the front surface along the first side surface, a second cut pattern extending from the front surface along the second side surface, and a cut groove connecting these cut patterns. This segmentation allows each component to independently manage strain in different directions, enabling reliable organic encapsulation layer formation while maintaining a manageable structure through modular design.

Inventive Principle:
Principle #1Segmentation

2Object-affected harmful factors

If the organic encapsulation layer is formed to cover particles, then protection from moisture and oxygen is improved, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveprotection from moisture and oxygenVSAvoidmanufacturing process complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The organic encapsulation layer is formed to cover particles before final device assembly and testing. This preliminary action ensures that particles are sealed off from moisture and oxygen early in the manufacturing process, preventing degradation. The inorganic encapsulation layers are subsequently formed to provide additional protection, creating a layered defense system that protects against harmful factors without requiring complex post-manufacturing interventions.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If inorganic encapsulation layers are added for additional protection, then device reliability is improved, but the device complexity increases

Engineering Contradiction:
Improvedevice reliabilityVSAvoidnumber of encapsulation layers
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The device employs a composite encapsulation system combining organic and inorganic materials. The organic encapsulation layer provides flexible particle coverage and moisture barrier, while the inorganic encapsulation layers provide rigid structural protection and additional moisture/oxygen barrier. This composite approach leverages the complementary strengths of different materials to achieve superior reliability without requiring excessive thickness or complexity in any single layer.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentEP3961715B1Display device and method of fabricating the same
Publication Date: 2025.04.30 SAMSUNG DISPLAY CO LTD
  • EP3961715B1 patent drawingFigure 1
  • EP3961715B1 patent drawingFigure 2
  • EP3961715B1 patent drawingFigure 3

AI summary

An embodiment of the invention provides a display device including a display panel including corner portions having cut patterns defined by cut portions. The display panel includes a substrate, a light-emitting element including a pixel electrode, an emissive layer and a common electrode and disposed on the substrate in the cut pattern, a first inorganic encapsulation layer disposed on the common electrode in the cut pattern; an organic encapsulation layer disposed on the first inorganic encapsulation layer in the cut pattern; and an organic pattern disposed on the substrate in the cut portions.