Display Device Coupling Member for Signal Interference Mitigation

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Solution Overview

Problem

Display devices face signal interference due to misalignment of connection wirings and pads, leading to potential short circuits and device failure.

Innovation Solution

A display device design featuring a coupling member with a non-conductive film portion overlapping the connection wirings and conductive film portions around it, preventing conductive material introduction into overlapping areas to mitigate misalignment-induced signal interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If connection pads and wirings are bonded directly without alignment tolerance, then electrical connection reliability is improved, but manufacturing precision requirements increase and device complexity increases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidalignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a coupling member as an intermediary component between the connection pad and the wiring. This coupling member includes a non-conductive film portion that provides a buffer zone, allowing the connection pad and wiring to be bonded even when they are slightly misaligned. The intermediary structure absorbs the alignment error and ensures reliable electrical connection through the conductive film portion while maintaining manufacturing feasibility.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a coupling member is introduced to prevent signal interference, then connection reliability is improved, but device complexity increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The coupling member is constructed using thin film structures, specifically a non-conductive film portion and conductive film portions. This thin film approach allows the coupling member to be integrated into the existing device architecture without significantly increasing overall device complexity or size. The film-based structure provides the necessary electrical isolation and connection functionality while maintaining a compact design.

Inventive Principle:
Principle #30Flexible shells and thin films

3Reliability

If connection pads extend along thickness direction to improve connection, then electrical connection is enhanced, but misalignment risk along second direction increases

Engineering Contradiction:
Improveelectrical connectionVSAvoidsignal interference
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The coupling member is designed with different functional regions: a non-conductive film portion that provides electrical isolation and a conductive film portion that provides electrical connection. This local differentiation of properties allows the structure to simultaneously enhance electrical connection through the conductive portion while preventing signal interference through the non-conductive portion, even when connection pads extend in the thickness direction.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11537011B2Display device
Publication Date: 2022.12.27 SAMSUNG DISPLAY CO LTD
  • US11537011B2 patent drawing
  • US11537011B2 patent drawing
  • US11537011B2 patent drawing

AI summary

A display device includes a first substrate including a display area including pixels, a non-display area disposed around the display area, and a base substrate, a second substrate facing the first substrate, and a printed circuit board attached to side surfaces of the first substrate and the second substrate, wherein the first substrate includes a plurality of connection wirings connected to the pixels, arranged on the base substrate, extending along a first direction, and spaced apart from each other along a second direction intersecting the first direction, and a plurality of connection pads arranged on the side surface of the first substrate and the side surface of the second substrate, connected to the connection wirings, extending along a thickness direction, and spaced apart from each other along the second direction, the first substrate further includes a coupling member disposed between the printed circuit board and the side surface of the first substrate and between the printed circuit board and the side surface of the second substrate, and the coupling member includes a non-conductive film portion disposed to overlap the connection wirings along the first direction, and a conductive film portion disposed around the non-conductive film portion.