Display Panel Crack Detection Using Peripheral Lines and Corner Chips
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Solution Overview
Problem
Display panels made of inorganic materials are prone to cracks due to panel design and process issues, which current inspection methods like SEM and XRM are costly and time-consuming, affecting the reliability and lifespan of the display device.
Innovation Solution
Incorporating crack detection lines in the display device's peripheral areas and using driving chips not used for light emission to detect cracks, allowing for accurate identification of crack locations in the upper or rear surface layers without the need for conventional microscopy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional inspection methods (SEM, XRM) are used to detect panel cracks, then measurement precision is improved, but loss of time and manufacturing cost increase significantly
Solution Approach 1:
The display panel performs self-diagnosis by utilizing its own driving chips and metal wirings to detect cracks. The system uses the panel's existing components (driving chips not used for light emission, metal wirings in rear and upper surface layers) to monitor crack conditions, eliminating the need for external conventional inspection equipment and significantly reducing inspection time while maintaining detection accuracy.
Solution Approach 2:
The patent replaces mechanical/optical inspection systems (SEM, XRM) with an electrical detection system. By using electrical signals transmitted through metal wirings and driving chips to detect crack conditions, the system substitutes complex mechanical inspection equipment with a simpler electrical measurement approach, reducing both time and cost while maintaining precision.
2Measurement precision
If conventional inspection methods (SEM, XRM) are used to detect panel cracks, then measurement precision is improved, but manufacturing cost increases
Solution Approach 1:
The display panel performs self-diagnosis by utilizing its own driving chips and metal wirings to detect cracks. The system uses the panel's existing components (driving chips not used for light emission, metal wirings in rear and upper surface layers) to monitor crack conditions, eliminating the need for external conventional inspection equipment and significantly reducing inspection time while maintaining detection accuracy.
Solution Approach 2:
The patent replaces mechanical/optical inspection systems (SEM, XRM) with an electrical detection system. By using electrical signals transmitted through metal wirings and driving chips to detect crack conditions, the system substitutes complex mechanical inspection equipment with a simpler electrical measurement approach, reducing both time and cost while maintaining precision.
3Device complexity
If driving chips not used for light emission are used for crack detection, then device complexity is reduced, but reliability of crack detection may be compromised
Solution Approach 1:
The driving chips are designed with multi-functionality, serving both their original purpose of driving light-emitting elements and the additional function of crack detection. By integrating crack detection capability into the existing driving chips and utilizing metal wirings for signal transmission, the system achieves reliable crack detection without adding separate dedicated detection components, thus maintaining simplicity while ensuring reliability.
Data Source
AI summary
A display device includes a substrate including a display area and a non-display area. A plurality of first driving chips are disposed on the display area, and a plurality of light emitting elements are disposed on the display area and electrically connected to the first driving chip. A plurality of second driving chips are disposed in each of spline areas defined in each of four corners of the display area, where each spline area has an arc shape. A plurality of crack detection lines extend along a peripheral area of the display area. The plurality of second driving chips are not electrically connected to the plurality of light emitting elements but are electrically connected to the plurality of crack detection lines.


