Display Apparatus Crack Propagation Control via Segmented Grooves

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Solution Overview

Problem

Existing display apparatuses are prone to a high occurrence rate of defects due to external impacts, which can lead to crack growth and damage across neighboring pixels.

Innovation Solution

The display apparatus incorporates a mask layer with openings, a substrate with corresponding grooves, an inorganic insulating layer with through holes, and an organic insulating layer that fills these holes, along with a barrier layer and a buffer layer to reduce crack propagation. This structure includes a bonding layer and a bottom metal layer to enhance stability and prevent disconnection between pixels.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional flat structure is used in display apparatus, then manufacturing is simple, but crack propagation occurs easily under external impact

Engineering Contradiction:
Improveresistance to crack propagationVSAvoidlayer structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the previously flat layer structure into multiple levels by introducing grooves at different depths (first grooves in substrate, second grooves in buffer layer) and creating through-holes in the inorganic insulating layer. This segmentation creates a stepped, non-planar structure that interrupts crack propagation paths while maintaining manufacturing feasibility through sequential processing steps.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from a two-dimensional flat layer structure to a three-dimensional stepped structure by adding vertical depth variations through grooves and through-holes. This dimensional change creates multiple elevation levels that physically block crack propagation while preserving the functional integrity of the display apparatus.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the inorganic insulating layer is made thicker to improve protection, then crack resistance improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improveprotection against external impactVSAvoidthrough hole alignment precision
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent performs preliminary actions by forming grooves in the substrate and buffer layer before creating the inorganic insulating layer and its through-holes. These pre-formed grooves serve as guides and structural features that facilitate subsequent through-hole formation, ensuring proper alignment and reducing manufacturing precision requirements despite the increased layer thickness.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent applies local quality by creating through-holes only in specific regions where the inorganic insulating layer needs to be penetrated, rather than making the entire layer uniformly thick or creating holes everywhere. This localized approach allows for optimized protection in critical areas while maintaining manufacturing feasibility.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20240179961A1Display apparatus
Publication Date: 2024.05.30 SAMSUNG DISPLAY CO LTD
  • US20240179961A1 patent drawing
  • US20240179961A1 patent drawing
  • US20240179961A1 patent drawing

AI summary

There is provided a display apparatus including a mask layer having a plurality of openings, a substrate located below the mask layer and having a plurality of first grooves corresponding to the plurality of openings, an inorganic insulating layer located on the mask layer and having through holes corresponding to at least some of the plurality of openings, and an organic insulating layer located on the inorganic insulating layer and filling the through holes.