Display Motherboard Cutting Marks That Resist Bubble Distortion
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Solution Overview
Problem
The challenge in producing flexible OLED display devices is that cutting marks in the cutting region cannot be identified due to bubbles forming during the preparation process, which affects the accuracy of cutting equipment in recognizing these marks.
Innovation Solution
A display motherboard structure is developed with a planarization layer and pixel definition layer retained in the cutting region, and the cutting mark layer is arranged on the same layer as the source-drain metal layer, enhancing the rigidity and reducing deformation caused by roller pressure, thus preventing bubble formation and ensuring accurate identification of cutting marks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the planarization layer and pixel definition layer are removed in the cutting region to simplify the structure, then the manufacturing process is simplified, but the rigidity of the film layer decreases and bubbles form during the roller attachment process
Solution Approach 1:
The patent applies local quality by differentiating the structure between the display substrate region and the cutting region. In the cutting region, the planarization layer and pixel definition layer are retained to provide rigidity and prevent bubble formation, while in the display substrate region, these layers are removed to simplify the structure. This localized structural differentiation resolves the contradiction between manufacturing simplification and rigidity requirements.
2Adaptability or versatility
If the cutting mark layer is arranged on a different layer than the source-drain metal layer, then the manufacturing process allows more flexibility, but the cutting marks cannot be accurately identified due to deformation from roller pressure
Solution Approach 1:
The patent merges the cutting mark layer with the source-drain metal layer by arranging them on the same layer. This integration ensures that the cutting marks are positioned on a structurally stable layer that is less susceptible to deformation from roller pressure during the attachment process, thereby maintaining accurate identification of cutting marks while still allowing manufacturing flexibility.
3Productivity
If the film layer structure is simplified by removing layers in the cutting region, then the production efficiency increases, but bubbles form during the roller attachment process affecting cutting mark identification
Solution Approach 1:
The patent applies local quality by selectively retaining the planarization layer and pixel definition layer only in the cutting region, while removing them in the display substrate region. This localized approach maintains the rigidity needed to prevent bubble formation during roller attachment in the cutting region, ensuring reliable cutting mark identification, while still achieving production efficiency through structural simplification in the display substrate region.
Data Source
AI summary
Provided are a display motherboard, a preparation method thereof, a display substrate and a display device. The display motherboard includes a plurality of display substrate regions and a cutting region located at a periphery of each of the plurality of display substrate regions; the display motherboard includes a driving structure layer arranged in each of the plurality of display substrate regions and a marking structure layer arranged in each cutting region, wherein the marking structure layer includes a cutting mark layer; and a planarization layer arranged on the driving structure layer and the marking structure layer, and covering the marking structure layer.