Display Device Data Conductive Layer Tip Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display devices face issues with the formation of tips in conductive layers, leading to cracks in passivation layers and potential damage to main conductive layers, which affects the reliability and performance of the display.
Innovation Solution
A new pad electrode structure is introduced, featuring a data conductive layer with multiple capping layers, including a third data capping layer with a higher etch rate than the first and second capping layers, made of materials like copper or zinc indium oxide, to prevent tip formation and enhance the profile of the conductive layer, thereby improving the reliability of the main conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional single-layer capping structure is used, then the manufacturing process is simple, but tips form in the conductive layer causing cracks in the passivation layer
Solution Approach 1:
The data conductive layer is segmented into multiple functional sub-layers: a data main metal layer for electrical conduction, a first data capping layer for adhesion and protection, a second data capping layer for additional protection, and a third data capping layer with higher etch rate specifically positioned to prevent tip formation at the pad opening. This segmentation allows each layer to address specific reliability issues without requiring complete structural redesign.
Solution Approach 2:
The third data capping layer is strategically positioned only in regions where tip formation is most likely to occur (at the pad opening area), while other areas maintain the standard multi-layer capping structure. This localized approach prevents tips at critical locations without unnecessarily complicating the entire conductive layer structure.
2Manufacturing precision
If the third data capping layer with higher etch rate is added, then tip formation is prevented and profile is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The third data capping layer is designed with a specific material composition (copper or zinc indium oxide) that provides a higher etch rate compared to conventional capping materials. This parameter change in etch rate allows the layer to be selectively removed or shaped during manufacturing, enabling precise profile control and tip prevention without requiring complex additional processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new structure prevents the formation of tips, reduces the risk of cracks in the passivation layer, and enhances the reliability of the main conductive layer, improving the overall performance and stability of the display device.
Implementation Method 1
The third data capping layer may have a higher etch rate than the first and second data capping layers for a same etchant
Data Source
AI summary
A display device includes a data conductive layer disposed on a substrate, a passivation layer disposed on the data conductive layer, a via layer disposed on the passivation layer, and a pixel electrode disposed on the via layer. The data conductive layer includes a data base layer, a data main metal layer disposed on the data base layer, a first data capping layer disposed on the data main metal layer, a second data capping layer disposed on the first data capping layer, and a third data capping layer disposed on the second data capping layer. The passivation layer and the via layer include a pad opening which exposes a portion of the data conductive layer in the pad area. The third data capping layer has a higher etch rate than the first and second data capping layers for a same etchant.