Multi-Layer Data Pad Layout for Display Device Short-Circuit Prevention

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Solution Overview

Problem

As the resolution of display devices increases, the number of pads required for connection increases, leading to a larger pad area and potential short-circuiting between connection wires and pads in adjacent rows, which necessitates increased spacing and larger pad areas to prevent short-circuits.

Innovation Solution

The display device employs data pads and connection wires in different layers, with pads in the same row sharing a layer and pads in adjacent rows being in different layers, reducing the distance between pads and wires while preventing short-circuits by ensuring they are in distinct layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the number of pads is increased to support higher resolution, then the connection capability is improved, but the pad area increases and the risk of short-circuit between connection wires and pads increases

Engineering Contradiction:
Improveconnection capabilityVSAvoidpad area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent transitions from a single-layer pad arrangement to a multi-layer structure where pads and connection wires are distributed across different layers. This dimensional change allows pads to be arranged in multiple rows without increasing the planar pad area, as connections can route through vertical layer transitions rather than requiring additional horizontal spacing.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the distance between connection wires and pads is increased to prevent short-circuit, then the electrical integrity is improved, but the pad area increases

Engineering Contradiction:
Improveelectrical integrityVSAvoidpad area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

By moving connection wires and pads to different layers, the patent eliminates the need for large lateral spacing while maintaining electrical integrity. The vertical separation between layers provides sufficient insulation distance, allowing compact planar arrangement without short-circuit risks.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces intermediate connection structures (such as contact holes and via structures) that bridge different layers. These intermediaries enable reliable electrical connection while maintaining proper spacing and insulation between adjacent pads and wires on the same layer, thus preventing short-circuits without requiring excessive lateral distance.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If pads are arranged in multiple rows to support higher resolution, then the connection capability is improved, but the risk of short-circuit between connection wires and pads in adjacent rows increases

Engineering Contradiction:
Improveconnection capabilityVSAvoidshort-circuit risk
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent distributes pads across multiple layers rather than confining them to a single planar row. This allows adjacent row pads to be positioned in different vertical layers, eliminating lateral overlap with connection wires and thus preventing short-circuits while maintaining high connection capability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10910409B2Display device
Publication Date: 2021.02.02 SAMSUNG DISPLAY CO LTD
  • US10910409B2 patent drawing
  • US10910409B2 patent drawing
  • US10910409B2 patent drawing

AI summary

A display device includes a substrate that includes a display area and a pad area, and a plurality of data pads that are provided on the pad area of the substrate and arranged along a first direction and a second direction, where the plurality of data pads includes a first data pad, a second data pad that is disposed adjacent to the first data pad along the first direction, a third data pad that is disposed adjacent to the first data pad along the second direction, and a fourth data pad that is disposed adjacent to the second data pad along the second direction, and the first data pad and the second connection wire are respectively disposed in different layers.