Display Device Detection Pad Segmentation for Resistance Measurement
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Solution Overview
Problem
Existing display devices face challenges in accurately measuring the connection resistance of integrated circuits due to resistance noise from adhesive films, which can be exacerbated by misalignment and variable resistance in the detection pad alignment.
Innovation Solution
The display device incorporates a detection pad with opposite contact points for ground and voltage connections, allowing test current to flow only to the ground contact point, thereby isolating the adhesive film resistance and reducing noise, ensuring accurate measurement of connection resistance regardless of alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a detection pad is used to measure connection resistance of the integrated circuit, then electrical connectivity testing is enabled, but resistance noise from the adhesive film and misalignment effects degrade measurement precision
Solution Approach 1:
The detection pad is divided into multiple contact points (first contact point and second contact point) positioned at opposite ends of the pad. This segmentation allows the measurement circuit to isolate and measure only the adhesive film resistance between these two points, separating it from other resistance components and enabling precise connection resistance measurement despite misalignment.
Solution Approach 2:
The adhesive film itself serves as the intermediary element being measured. By positioning contact points at opposite ends of the detection pad and measuring resistance specifically between these points, the adhesive film resistance becomes the dominant and isolatable component in the measurement, acting as the primary indicator of connection quality while minimizing interference from other factors.
2Ease of operation
If contact points are positioned on the detection pad for ground and voltage connections, then electrical measurement is enabled, but misalignment between the detection pad and integrated circuit increases resistance noise
Solution Approach 1:
The contact points are positioned at opposite ends of the detection pad along its length, utilizing the full dimensional extent of the pad. This dimensional arrangement ensures that the measurement path through the adhesive film is maximized and distinct from lateral misalignment effects, allowing accurate measurement even when the integrated circuit is not perfectly aligned with the detection pad.
Solution Approach 2:
The first and second contact points are positioned asymmetrically at opposite ends of the detection pad rather than symmetrically. This asymmetric positioning creates a measurement path that is less sensitive to rotational misalignment and ensures that the adhesive film resistance measurement remains accurate regardless of the degree of alignment between the detection pad and integrated circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise measurement of the integrated circuit's connection resistance by isolating the adhesive film's resistance, reducing noise and ensuring accurate testing regardless of alignment, thus improving the reliability of electrical connectivity assessments.
Implementation Method 1
the adhesive film connecting the detection pad and the integrated circuit
Implementation Method 2
resistance noise from adhesive films
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A display device including: a first test pad disposed on a substrate; a detection pad disposed on the substrate; a first voltage pad disposed on the substrate and electrically connected to the first test pad; a ground pad disposed on the substrate and electrically connected to the detection pad through a first contact point of the detection pad; and a second voltage pad disposed on the substrate and electrically connected to the detection pad through a second contact point of the detection pad, wherein the second contact point is opposite to the first contact point in a first direction.