Display Device Conductive Layer Etching Selectivity
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Solution Overview
Problem
The efficiency of display device manufacturing processes is hindered by the occurrence of cracks in passivation layers due to differing etching selectivities of laminated conductive layers, leading to reduced process reliability and increased tip formation during mask processes.
Innovation Solution
A display device structure featuring a conductive layer with a base layer, a main metal layer including copper, a first conductive capping layer, and a second conductive capping layer, where the second capping layer is aligned in parallel with the first capping layer, and the second capping layer's material has similar selectivity to the main metal layer, reducing tip formation and enhancing reliability by preventing direct contact with reactive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mask processes are added one by one for patterning wirings and insulating films, then manufacturing precision is improved, but process efficiency deteriorates
Solution Approach 1:
The patent combines multiple mask processes into a single integrated process by using a unified conductive layer structure with consistent etching selectivity. The laminated conductive layers are designed to have matching etching rates, allowing simultaneous patterning of multiple layers through one mask process, thereby improving process efficiency while maintaining patterning precision.
2Manufacturing precision
If chemical materials with different etching selectivities are used in mask processes, then manufacturing precision is improved, but reliability deteriorates due to tip formation and cracks
Solution Approach 1:
The patent applies homogeneity by designing the laminated conductive layers to have uniform etching selectivity characteristics. The conductive layers are constructed with materials and thicknesses that ensure consistent etching rates across all layers, eliminating the tip formation caused by differential etching. This homogeneous etching behavior prevents crack formation in the passivation layer while maintaining the ability to achieve precise patterning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure suppresses the occurrence of cracks in the passivation layer and improves the reliability of the display device by aligning the conductive layer surfaces and using materials with similar etching selectivities, thereby enhancing manufacturing efficiency and reducing tip formation.
Implementation Method 1
a first conductive layer on the substrate; the first conductive layer including a base layer, a main metal layer on the base layer and including copper, a first conductive capping layer on the main metal layer, and a second conductive capping layer on the first conductive capping layer
Data Source
AI summary
A device includes a substrate including a display area and a pad area; a first conductive layer on the substrate; and a first insulating film on the first conductive layer, the first insulating film having a first contact hole in the display area to expose the first conductive layer and a pad opening exposing the first conductive layer in the pad area, the first conductive layer being arranged such that in a first region covered by the first insulating film, a second conductive capping layer of the first conductive layer is entirely on a first conductive capping layer of the first conductive layer; in a second region overlapping the contact hole, the second conductive capping layer is entirely on the first conductive capping layer; and in a third region exposed by the pad opening, the second conductive capping layer exposes at least a portion of the first conductive capping layer.