Display Device Connection Pad Height Variation for Direct Transfer
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Solution Overview
Problem
Existing display devices face challenges in reducing interference between transferred light emitting elements, increasing manufacturing time and costs, and minimizing defect rates during the transfer process.
Innovation Solution
A display device with a stretchable lower substrate and pattern layer featuring individual connection pads and a common connection pad of varying heights, allowing direct transfer of light emitting elements from a wafer to a display panel, thereby minimizing interference and streamlining the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light emitting elements are transferred using a donor substrate, then the transfer process can be completed, but the manufacturing time increases and costs increase
Solution Approach 1:
The patent extracts and eliminates the donor substrate from the transfer process. Light emitting elements are transferred directly from the wafer to the display panel without requiring an intermediate donor substrate, thereby reducing manufacturing steps, time, and costs while maintaining transfer effectiveness.
2Productivity
If light emitting elements are transferred directly from wafer to display panel, then manufacturing time and costs are reduced, but interference between light emitting elements may occur
Solution Approach 1:
The patent applies local quality by creating height differences at specific locations (connection pads) on the display panel. The connection pads are formed with varying heights corresponding to different sub-pixels, which creates localized elevation differences that guide and separate light emitting elements during direct transfer from the wafer, preventing interference while maintaining high manufacturing efficiency.
3Device complexity
If connection pads are at the same height, then the structure is simple, but interference between transferred light emitting elements increases
Solution Approach 1:
The patent transitions from a two-dimensional planar structure to a three-dimensional structured connection pad system by creating height differences in the connection pads. This dimensional change allows the connection pads to protrude at different levels corresponding to different sub-pixels, providing spatial separation that prevents interference between light emitting elements during transfer while maintaining reasonable structural complexity.
Data Source
AI summary
A display device according to an example embodiment of the present disclosure includes a stretchable lower substrate; and a pattern layer disposed on the lower substrate and including a plurality of plate patterns on which a plurality of sub-pixels are disposed and a plurality of line patterns; a plurality of individual connection pads and a common connection pad disposed on each of the plurality of plate patterns and having different heights corresponding to each of the plurality of sub-pixels; and a plurality of light emitting elements connected to the plurality of individual connection pads and the common connection pad.