Display Device Heat Dissipation System

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Solution Overview

Problem

Existing display devices face challenges in effectively cooling electronic components separated from the display panel, leading to heat management issues.

Innovation Solution

A display device design that incorporates a heat dissipation system with a metal heat dissipation portion and air flow management, including slits and openings, to efficiently transfer heat away from electronic components within the control unit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components are separated from the display panel and stacked in a control unit, then design flexibility and integration are improved, but heat accumulation worsens due to poor cooling

Engineering Contradiction:
Improvedesign flexibilityVSAvoidheat accumulation
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The control unit is divided into multiple stacked layers (first control board, second control board, power supply unit) with heat dissipation portions integrated into each layer. This segmentation allows independent heat management for each component stack, enabling effective cooling of high-heat components while maintaining compact integration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A heat dissipation portion acts as an intermediary thermal management component between the stacked electronic components and the cooling system. This heat dissipation structure receives heat from multiple components and transfers it to cooling channels, enabling efficient heat removal from the compact stacked configuration.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If multiple electronic components are stacked to improve integration, then device compactness is improved, but cooling effectiveness worsens due to limited air flow access

Engineering Contradiction:
Improveintegration levelVSAvoidcooling effectiveness
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The cooling system transitions from two-dimensional surface cooling to three-dimensional internal cooling by forming cooling channels within the heat dissipation portion. These channels penetrate through the heat dissipation structure, enabling cooling air to reach stacked components from multiple directions and depths, effectively cooling components that would be inaccessible in conventional flat configurations.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cooling channels are nested within the heat dissipation portion, with inlet and outlet channels positioned at different depths and locations. This nested arrangement allows cooling air to flow through multiple stages, reaching components at different stack levels while maintaining a compact integrated structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Temperature

If heat dissipation portions are formed with complex internal channels to improve cooling, then cooling effectiveness is improved, but manufacturing complexity worsens

Engineering Contradiction:
Improvecooling effectivenessVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The cooling system is segmented into distinct inlet channels and outlet channels with specific functions. The inlet channel receives cooling air and directs it to target components, while the outlet channel collects heated air. This functional segmentation simplifies the design and manufacturing of complex cooling systems by breaking them into manageable, standardized channel modules.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat dissipation portion serves multiple functions simultaneously: it provides structural support for stacked components, acts as a thermal conduction path, and contains integrated cooling channels. This multi-functionality reduces the need for separate cooling components, simplifying manufacturing while maintaining effective cooling.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively cools stacked electronic components, maintaining optimal operating temperatures and improving the performance and reliability of the display device.

Implementation Method 1

a heat dissipation system with a metal heat dissipation portion and air flow management

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP3280135B1Display device
Publication Date: 2020.10.07 LG ELECTRONICS INC
  • EP3280135B1 patent drawingFigure 1
  • EP3280135B1 patent drawingFigure 2
  • EP3280135B1 patent drawingFigure 3

AI summary

There is disclosed a display device. The display device of this invention may comprise a display unit including a display panel, the display panel providing an image; a housing spaced apart from the display unit, the housing including an electrical unit and a speaker module; and a cable electrically connected with the display panel and the electrical unit. The electrical unit may comprises: a first electronic component providing the display panel with a signal; and a second electronic component providing the display panel with electric power.