Display Device Heat Insulating Frame Backlight Thermal Management

The patent divides the internal space of the housing into distinct regions using partition walls. The control substrate is placed in a separate control substrate accommodating space that is thermally isolated from the backlight unit's heat-generating region, while still maintaining centralized control functionality. This spatial segmentation resolves the contradiction by allowing simplified control architecture without direct heat exposure.

The patent introduces air as a thermal intermediary by creating an air gap between the backlight unit and the control substrate through the partition wall structure. This air layer acts as a thermal barrier that prevents direct heat transfer to the control substrate, allowing the control substrate to be positioned on the backside for simplified control while protecting it from harmful heat effects.

The patent employs natural convection and radiation for heat dissipation by designing the partition wall structure to allow hot air to rise and escape naturally from the backlight unit region. The control substrate accommodating space is thermally isolated, allowing the backlight unit to self-regulate its temperature through passive heat dissipation mechanisms, eliminating the need for active blowers and reducing device complexity.

The patent transitions from one-dimensional direct contact heat transfer to three-dimensional thermal management by creating a volumetric air gap through partition walls. This spatial dimensioning allows heat to dissipate in multiple directions (convection currents, radiation) rather than being confined to direct contact paths, enhancing heat dissipation without requiring additional active cooling components.

The patent segments the housing interior into thermally isolated zones using partition walls. The control substrate is housed in a separate space that is thermally decoupled from the backlight unit, allowing high power consumption for improved illuminance without proportionally increasing heat impact on electronic parts. The partition wall creates independent thermal management zones.

The patent introduces air gaps and partition wall structures as thermal intermediaries between the high-power backlight unit and the heat-sensitive control substrate. These intermediaries allow the backlight unit to operate at high power for improved illuminance while the thermal barrier prevents excessive heat transfer to the electronic parts, protecting them from adverse effects.