Display Device Heat Sink Between Backplanes

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Solution Overview

Problem

Outdoor display devices face reduced service life due to ineffective heat emission from display modules, leading to excessively high internal temperatures, especially in high ambient temperatures.

Innovation Solution

The display device incorporates a first and second backplane with a heat sink positioned between them, featuring elongated members and grooves for enhanced heat conduction, along with thermoelectric coolers and fans for efficient heat radiation, including a second heat sink connected via extension sections and a fixing base for stable thermal conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat sink is added between the backplanes to improve heat radiation, then heat dissipation effectiveness is improved, but device complexity increases

Engineering Contradiction:
Improveheat radiation effectivenessVSAvoidstructure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The first heat sink is nested between the first and second backplanes, utilizing the existing spatial arrangement of display modules. The heat sink is positioned within the sandwich structure formed by the backplanes, allowing heat dissipation without requiring additional external space or complex mounting arrangements.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The heat sink is divided into multiple elongated members arranged in parallel, with grooves provided between adjacent elongated members. This segmentation increases the surface area for heat radiation and creates channels for air flow, improving heat dissipation effectiveness while maintaining a compact structure.

Inventive Principle:
Principle #1Segmentation

2Temperature

If multiple elongated members with grooves are used to enhance heat conduction, then heat dissipation effectiveness is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveheat conduction effectivenessVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

Grooves are provided between adjacent elongated members at specific locations where heat dissipation is most needed. The grooves create localized air channels that enhance convective heat transfer from the backplanes to the surrounding environment, improving heat conduction effectiveness without requiring complex manufacturing processes for the entire heat sink structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves heat radiation from the display modules, extending their service life by effectively managing high temperatures and ensuring balanced heat dissipation.

Implementation Method 1

a first heat sink located between the first backplane and the second backplane, and configured to radiate heat from the first backplane and the second backplane

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

configured to radiate heat from the first backplane and the second backplane

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

a second heat sink including a plurality of thermoelectric coolers

Methodology Applied
Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS11428976B2Display device and electronic device
Publication Date: 2022.08.30 K TRONICS (SUZHOU) TECH CO LTD
  • US11428976B2 patent drawing
  • US11428976B2 patent drawing
  • US11428976B2 patent drawing

AI summary

The present disclosure relates to a display device and an electronic device. The display device includes: a first display module having a first backplane; a second display module having a second backplane located on an opposite side of the first backplane; and a first heat sink located between the first backplane and the second backplane, and configured to radiate heat from the first backplane and the second backplane.