Display Device Insulating Spacer for Driver IC Protection
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Solution Overview
Problem
In liquid crystal display devices, the overlapping of driver ICs leads to temperature rises, and the narrow frame design can cause electrical connections between flexible printed circuits to be compromised, resulting in short circuits and potential damage to the driver circuit and substrate due to stress concentration.
Innovation Solution
The implementation of a spacer portion with insulating properties between the substrate connecting member and the driver circuit, along with spacer joint portions on non-overlapping substrate sections, reduces the likelihood of short circuits and stress concentration, thereby protecting the driver circuit and substrate from damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the frame of the liquid crystal display device is further narrowed, then the device size is reduced, but the distance between the connecting point of the flexible printed circuit and the driver IC decreases, increasing the risk of short circuits
Solution Approach 1:
An insulating spacer is introduced as an intermediary component between the flexible printed circuit and the driver IC. This spacer physically separates the connecting point of the flexible printed circuit from the driver IC, preventing direct contact that could cause short circuits while allowing the frame to be narrowed for reduced device size.
Solution Approach 2:
The space between the flexible printed circuit and driver IC is segmented by introducing the insulating spacer, which divides the potential contact area into separated zones. This segmentation ensures that even when the frame is narrowed, the electrical connection points remain isolated from the driver IC, maintaining reliability while reducing overall device dimensions.
2Ease of manufacture
If the flexible printed circuits are mounted on a single component substrate, then the assembly process is simplified, but stress concentration on the substrate increases, making it more susceptible to damage
Solution Approach 1:
The insulating spacer is disposed in advance between the flexible printed circuit and the driver IC mounting area on the substrate. This preliminary placement of the spacer creates a protective barrier that distributes mechanical stress during the mounting process, preventing stress concentration on the substrate while maintaining the simplicity of using a single component substrate for assembly.
3Volume of moving object
If driver ICs are disposed to overlap each other to save space, then the device size is reduced, but temperature rise of the driver ICs increases
Solution Approach 1:
The insulating spacer acts as a thermal and electrical intermediary between overlapping driver ICs and the substrate. By positioning the spacer between the driver ICs and the substrate surface, heat generated by the overlapping driver ICs is prevented from concentrating on the substrate, allowing compact overlapping arrangements while managing temperature rise.
Data Source
AI summary
A display device includes a first substrate, a second substrate, s driver circuit, a first substrate connecting member, a spacer portion, and a spacer joint portion. The second substrate is opposed to overlap the first substrate and includes a first substrate non-overlapping portion not overlapping the first substrate. The driver circuit is mounted on the first substrate non-overlapping portion on a same side as the first substrate. The first substrate connecting member is connected to the first substrate and includes a portion disposed to overlap the driver circuit. The spacer portion is disposed between the first substrate connecting member and the driver circuit. The spacer portion has an insulating property. The spacer joint portion is disposed to overlap a section of the first substrate non-overlapping portion not overlapping at least the driver circuit on the same side as the first substrate.