Display Device Integrated Wiring Substrate Frame Width Reduction
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Solution Overview
Problem
Existing display devices face challenges in reducing the width of the frame due to the need for multiple wiring substrates and complex connections between substrates, which increases the non-display area and makes it difficult to minimize the overall frame width.
Innovation Solution
A display device structure that includes a first substrate with a conductive layer and a second substrate with a conductive layer connected via a hole, using a connecting material to electrically connect the layers, allowing for reduced wiring substrate requirements and minimizing the non-display area, thereby reducing the frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple wiring substrates are used to connect display substrates, then electrical connections can be established, but the non-display area increases and frame width cannot be minimized
Solution Approach 1:
The invention merges the functions of multiple separate wiring substrates into a single integrated wiring substrate. This wiring substrate contains multiple wiring layers that are stacked and interconnected through via holes, eliminating the need for multiple separate substrates while maintaining all necessary electrical connections between display substrates.
Solution Approach 2:
The invention transitions from a planar arrangement of multiple wiring substrates to a three-dimensional stacked structure. Multiple wiring layers are arranged vertically within a single substrate, connected through via holes that penetrate through the substrate thickness, utilizing the third dimension (depth) to reduce the horizontal footprint.
2Reliability
If multiple wiring substrates are used for connections, then electrical connectivity is achieved, but the overall frame width increases
Solution Approach 1:
The invention combines multiple wiring substrate functions into one integrated substrate with stacked wiring layers, reducing the horizontal space required for connections and thereby minimizing the overall frame width.
Solution Approach 2:
Multiple wiring layers are nested within a single wiring substrate, with each layer contained within the boundaries of the same substrate. This nesting approach allows multiple connection functions to coexist in a compact vertical arrangement rather than requiring separate horizontal substrates.
3Reliability
If complex connections between substrates are implemented, then electrical connections are established, but the manufacturing process becomes more complicated
Solution Approach 1:
The wiring substrate is segmented into multiple distinct wiring layers, each performing specific connection functions. This segmentation allows for modular design and manufacturing, where each layer can be formed and connected systematically through standardized via hole processes.
Solution Approach 2:
The via holes and conductive materials are prepared in advance during the substrate manufacturing process, establishing connection paths before the final assembly. This preliminary preparation simplifies the overall manufacturing process by integrating connection formation into the substrate fabrication rather than requiring post-assembly connection steps.
Data Source
AI summary
According to one embodiment, a display device includes a first substrate including a first basement, a scanning line and a signal line, arranged in a display area, a first organic insulating layer covering the signal line, a metal layer provided above the first organic insulating layer, and a first conductive layer arranged in a peripheral area surrounding the display area and formed from a same material as that of the metal layer, a second substrate including a second basement opposing the first conductive layer and spaced therefrom, and a second conductive layer, and including a first hole which penetrates the second basement, and a connecting material which electrically connects the first conductive layer and the second conductive layer via the first hole.