Display Device High Density Light Emitting Elements Heat Dissipation

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Solution Overview

Problem

Current display devices, particularly those used in head-mounted virtual or augmented reality applications, face challenges in achieving ultra-high resolution due to limitations in the density and arrangement of light emitting elements, which affects the display area efficiency and heat dissipation.

Innovation Solution

The design incorporates a display device with a high density of inorganic light emitting elements, optimized pad and electrode arrangements, and a heat dissipation layer to enhance heat management, allowing for a larger display area and improved resolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the density of light emitting elements is increased to achieve ultra-high resolution, then the display area efficiency is improved, but the heat dissipation becomes more difficult

Engineering Contradiction:
Improvedisplay resolutionVSAvoidheat dissipation
Core Design Contradiction:
Measurement precisionVSTemperature

Solution Approach 1:

The patent divides the substrate into distinct regions: a display area containing light emitting elements and a non-display area containing heat dissipation structures. This spatial segmentation allows high-density light emitting elements to be concentrated in the display area while dedicating the non-display area exclusively for heat dissipation, thereby resolving the contradiction between achieving high resolution through increased element density and managing the resulting heat generation.

Inventive Principle:
Principle #1Segmentation

2Productivity

If the number of light emitting elements per unit area is increased, then the display area is optimized, but the heat-related issues increase

Engineering Contradiction:
Improvelight emitting elements per unit areaVSAvoidheat-related issues
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent extracts the heat dissipation function from the display area and relocates it to a dedicated non-display area. By separating the light emitting elements (which generate heat) from the heat dissipation structures, the invention allows the display area to be optimized for maximum light emitting element density while the extracted heat dissipation system handles the thermal management, thus resolving the contradiction between productivity and harmful heat generation.

Inventive Principle:
Principle #2Taking out (Extraction)

3Measurement precision

If the display area is enlarged to improve resolution, then the number of light emitting elements increases, but the heat generation increases

Engineering Contradiction:
Improvedisplay resolutionVSAvoidheat generation
Core Design Contradiction:
Measurement precisionVSQuantity of substance

Solution Approach 1:

The patent utilizes the vertical dimension by extending heat dissipation structures into via holes that pass through the substrate thickness. This three-dimensional arrangement allows heat dissipation components to occupy the non-display area in the vertical dimension, enabling the horizontal display area to be maximized for light emitting elements while the vertical space is used for heat dissipation pathways, thus resolving the contradiction between display area enlargement and heat generation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20220352444A1Display device
Publication Date: 2022.11.03 SAMSUNG DISPLAY CO LTD
  • US20220352444A1 patent drawing
  • US20220352444A1 patent drawing
  • US20220352444A1 patent drawing

AI summary

A display device includes a first substrate, light emitting elements and a connection electrode on a first surface of the first substrate, and electrically connected to the light emitting elements, first pads spaced from the connection electrode in a direction, second pads spaced from the connection electrode in another direction, a circuit board including a first circuit board pad and a second circuit board pad, a first pad connection electrode connected to the first pads and the first circuit board pad, and including a first connection part in a first via hole passing through the first substrate, and a first electrode part on the first substrate, and a second pad connection electrode connected to the second pads and the second circuit board pad, and including a second connection part in a second via hole passing through the first substrate, and a second electrode part on the first substrate.