Display Device Resistive Element Vertical Stacking
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Solution Overview
Problem
The existing display devices face challenges in reliably forming resistive elements on substrates with pixels due to difficulties in securing the length of semiconductor layers for desired resistance values, particularly when using the resist reflow process, which often results in discontinuities between terminals.
Innovation Solution
The display device incorporates a resistive element formed using a semiconductor layer between the end portions of conductive layers, with additional conductive layers positioned apart from these ends, allowing for a protruding semiconductor layer configuration that ensures continuous current flow and avoids discontinuities, even when using the resist reflow process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the resist reflow process is applied to form the resistive element using the semiconductor layer, then the manufacturing process is simplified and performed in parallel with pixel formation, but it becomes difficult to form the semiconductor layer long enough to achieve the desired resistance value
Solution Approach 1:
The invention transitions from a single-layer conductive structure to a multi-layer conductive structure with conductive layers stacked in the vertical dimension. By forming multiple conductive layers (first, second, and third conductive layers) at different heights on the semiconductor layer, the patent achieves the desired resistance value while maintaining a compact planar footprint, effectively utilizing the third dimension to resolve the length constraint imposed by the resist reflow process.
2Productivity
If the photoresist film is allowed to reflow to eliminate the need for additional mask processes, then manufacturing steps are reduced, but discontinuities occur in the semiconductor layer between terminals
Solution Approach 1:
The invention segments the conductive path into multiple separate conductive layers (first, second, and third conductive layers) stacked vertically rather than relying on a single continuous planar layer. This segmentation allows each layer to be formed and positioned independently, ensuring continuous electrical connection through the stack while accommodating the discontinuities that occur during the resist reflow process, thereby maintaining both manufacturing efficiency and structural reliability.
3Ease of operation
If the same material as drain and source electrodes is used for terminals, then material consistency is maintained, but the semiconductor layer cannot be formed long enough for sufficient resistance
Solution Approach 1:
The patent resolves the conflict between material consistency and resistance precision by extending the conductive path into the vertical dimension through multiple stacked conductive layers. This allows the use of the same material for all terminals (maintaining ease of operation) while achieving the desired resistance value through the cumulative effect of current passing through multiple layers, thereby achieving manufacturing precision without sacrificing material consistency.
Data Source
AI summary
To provide a display device capable of reliably forming a resistive element formed on a substrate including pixels. A display device including at least a thin-film transistor and a resistive element on a substrate has a gate electrode, an insulating film, a semiconductor layer and a conductive layer which are sequentially stacked on the substrate, in which the resistive element is formed by using the semiconductor layer formed between end portions of wiring made of the conductive layer as a resistive body, and at least one conductive layer apart from the end portions is formed on the semiconductor layer between the end portions of wiring.