Display Device Non-Display Area Reduction via 3D Stacking

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Solution Overview

Problem

Current display devices have a significant non-display area, which limits their miniaturization and integration capabilities, and lack additional functional elements such as light-emitting or antenna elements.

Innovation Solution

The display device incorporates a substrate with a common electrode layer, a driving layer, and a display layer, featuring conductive vias and protective pads, along with a sealing membrane and additional elements like light-emitting or antenna elements, to minimize the non-display area and enhance integration by strategically arranging these components within a housing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the display device uses a conventional structure without additional elements, then the structure is simple, but the non-display area is large and integration capability is limited

Engineering Contradiction:
Improveintegration capabilityVSAvoidnon-display area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent combines the driving chip and additional functional elements (light-emitting element, antenna element) into the same housing as the display layer, merging previously separate functional modules into a single integrated unit. This reduces the overall non-display area while maintaining or enhancing integration capability.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a planar arrangement of components to a three-dimensional stacked configuration, with the driving chip, light-emitting element, and antenna element positioned in different spatial layers within the housing. This vertical integration reduces the horizontal non-display area while preserving functionality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the display device includes additional elements like light-emitting or antenna elements, then functionality is enhanced, but the structure becomes more complex

Engineering Contradiction:
ImprovefunctionalityVSAvoidstructure
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The housing serves multiple functions simultaneously: it encloses the display layer, accommodates the driving chip, positions the light-emitting element, and houses the antenna element. This multi-functional design enhances functionality while avoiding the need for separate structural components that would increase complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent employs a nested arrangement where the driving chip, light-emitting element, and antenna element are positioned within the housing structure, with components nested within each other or arranged in concentric layers. This nesting approach integrates additional elements without proportionally increasing overall structural complexity.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Volume of moving object

If the non-display area is reduced for miniaturization, then compactness is improved, but space for additional elements is limited

Engineering Contradiction:
Improvedevice compactnessVSAvoidintegration of additional elements
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent utilizes the vertical dimension by stacking the display layer, driving chip, light-emitting element, and antenna element in different layers within the housing. This three-dimensional arrangement achieves miniaturization by reducing horizontal footprint while providing sufficient space for multiple additional elements through vertical stacking.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nesting by positioning the driving chip, light-emitting element, and antenna element within the housing volume, with components nested within each other or arranged in concentric configurations. This allows multiple additional elements to be integrated into a compact volume without requiring proportional increases in overall device size.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for a reduced non-display area and increased integration of additional elements, improving the display device's compactness and functionality.

Implementation Method 1

An electrophoretic display having the highest degree of commercialization uses an electrophoretic phenomenon that charged particles are moved by an electric field applied in a state in which the charged particles are distributed in a dielectric fluid

Methodology Applied
Scientific EffectElectrophoresis: Electrophoresis

Implementation Method 2

A micro-cup structure is formed by shaping a photosensitive polymer layer by a roller having a patterned surface and then curing the shaped photosensitive polymer layer by ultraviolet rays

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS20240126131A1Display device
Publication Date: 2024.04.18 SOLUM CO LTD
  • US20240126131A1 patent drawing
  • US20240126131A1 patent drawing
  • US20240126131A1 patent drawing

AI summary

A display device includes a substrate, a common electrode layer on the substrate where the common electrode layer includes a first common pad protruding in a second direction from a first reference side surface extending in a first direction and the second direction intersects the first direction, a driving layer between the substrate and the common electrode layer, a display layer between the driving layer and the common electrode layer, a first conductive via apart from the driving layer and between the substrate and the first common pad, and a driving chip at an opposite side of the first conductive via with reference to the driving layer.