Display Device Thermal Management via IC Contact Heat Dissipation
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Solution Overview
Problem
Display devices with integrated circuit chips generate significant heat due to high data transmission demands, leading to thermal management challenges that existing technologies fail to adequately address, particularly in driver and control circuit boards.
Innovation Solution
The implementation of a display device design featuring a supporting member with a contact heat dissipating portion that contacts the integrated circuit chips, and a thermal conductive cover member with a heat dissipating pad for effective heat dissipation, utilizing materials with high thermal conductivity to manage heat generated by the integrated circuit chips in both driver and control circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If high data transmission is used to achieve higher resolution display, then display resolution is improved, but heat generation in integrated circuit chips increases
Solution Approach 1:
The harmful heat generated by the integrated circuit chip is extracted and separated from the chip itself by introducing a heat dissipating pad that contacts the chip. This pad absorbs and conducts the heat away from the chip, isolating the heat generation source from the sensitive electronic components while maintaining the high data transmission capability for high resolution display
Solution Approach 2:
A heat dissipating pad is introduced as an intermediary element between the integrated circuit chip and the surrounding environment. This pad serves as a thermal conductor that mediates the heat transfer process, conducting heat away from the chip to the supporting member or housing, thereby protecting the chip from overheating while allowing high data transmission to continue
2Productivity
If integrated circuit chips are mounted on driver and control circuit boards to enable high resolution display, then display capability is improved, but thermal management becomes inadequate
Solution Approach 1:
The thermal management solution extends into a new dimension by adding a vertical heat dissipation path. The heat dissipating pad is positioned to contact the integrated circuit chip from above (or below), creating a third-dimensional thermal conduction path that is perpendicular to the circuit board plane. This allows heat to be conducted away from the chip in a direction orthogonal to the board, providing effective thermal management while maintaining the high capability display function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the temperature of integrated circuit chips in driver and control circuit boards, preventing electrical defects and damage, and ensuring efficient heat dissipation even under high load and elevated temperature conditions.
Implementation Method 1
a contact heat dissipating portion that protrudes from the supporting body and comes in contact with the driver integrated circuit packages in an area where the integrated circuit chip is formed
Implementation Method 2
a thermal conductive cover member with a heat dissipating pad for effective heat dissipation, utilizing materials with high thermal conductivity
Data Source
AI summary
In accordance with an embodiment of the present invention, a display device is provided that includes a display panel configured to display an image, a plurality of driver integrated circuit packages that include a base film and an integrated circuit chip mounted on the base film and of which one side is attached to an edge of the display panel, and a supporting member that fixedly supports the display panel. The supporting member includes a supporting body that fixedly supports the display panel, and a contact heat dissipating portion that protrudes from the supporting body and comes in contact with the driver integrated circuit packages in an area where the integrated circuit chip is formed.