Display Module Diffusion Bonding for Low-Resistance Connections
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Solution Overview
Problem
Anisotropic conductive films (ACF) exhibit high connection resistance between mounting boards and displays due to thermocompression bonding, which limits the efficiency of electrical connections.
Innovation Solution
A display module with a mounting board featuring bumps that are bonded to connection terminals on a display using solid-phase diffusion bonding at 100° C or lower, reducing thermal damage and connection resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermocompression bonding with anisotropic conductive film is used, then electrical connection between mounting board and display is achieved, but connection resistance becomes high (one ohm or more)
Solution Approach 1:
The patent changes the bonding temperature parameter from high temperature (thermocompression bonding) to low temperature (solid-phase diffusion bonding at 100°C or lower). This parameter change enables direct metal-to-metal bonding between bumps and connection terminals, eliminating the need for conductive particles and achieving lower connection resistance while maintaining manufacturing feasibility
Solution Approach 2:
The patent replaces the thermocompression bonding mechanism with solid-phase diffusion bonding. Instead of using heat and pressure to compress conductive particles between terminals, the invention uses solid-phase diffusion where metal atoms directly diffuse across the bonding interface at low temperatures, creating a direct conductive path with lower resistance
2Strength
If high temperature bonding is used, then strong bonding between mounting board and display is achieved, but thermal damage and warpage occur
Solution Approach 1:
The patent fundamentally changes the bonding temperature parameter from high temperature to 100°C or lower. This low-temperature solid-phase diffusion bonding achieves sufficient bonding strength through direct metal diffusion while avoiding thermal damage to the display and preventing warpage of the mounting board
3Speed
If conventional bonding methods are used, then electrical connection is established, but connection resistance remains high limiting high-speed transmission
Solution Approach 1:
By changing the bonding temperature and method parameters, the patent achieves direct metal-to-metal bonding with low contact resistance. This enables high-speed signal transmission between the mounting board and display, overcoming the limitation of conventional high-resistance connections
Solution Approach 2:
The replacement of thermocompression bonding with solid-phase diffusion bonding creates a direct conductive path without conductive particle interference. This substitution reduces contact resistance and enables high-speed transmission capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces connection resistance, allows for smaller display module sizes, and enhances high-speed transmission capabilities while minimizing thermal stress and potential for warpage during bonding.
Implementation Method 1
bonding a bump of a mounting board and a connection terminal of a display by solid-phase diffusion bonding at 100° C. or lower
Data Source
AI summary
Provided is a display module capable of reducing connection resistance between a mounting board and a display.A display module includes a mounting board provided with a bump, and a display mounted on the mounting board and provided with a connection terminal bonded to the bump by solid-phase diffusion bonding.