Display Substrate Discharge Layout for Plasma Arcing Prevention
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Solution Overview
Problem
High-integrated display devices face manufacturing defects due to static electricity and plasma arcing during deposition and mask contact, with existing methods like anodizing being insufficient to prevent these issues.
Innovation Solution
Incorporating an outer discharge line, inner discharge line, discharge link, and static electricity discharge circuit to effectively discharge overcurrent and prevent arcing, with the outer discharge line positioned outside a dam on the substrate, the inner discharge line inside the dam, and the discharge link connecting them, all electrically connected to a static electricity discharge circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a mask is used for deposition on a high-integrated transistor board, then deposition can be performed, but static electricity and foreign bodies cause defects
Solution Approach 1:
The patent applies preliminary action by forming a static electricity discharge circuit and discharge lines before the deposition process. The discharge lines are pre-configured to conduct static electricity away from critical areas, and the circuit is prepared in advance to activate during deposition, preventing defects before they occur rather than addressing them afterward.
Solution Approach 2:
The patent uses discharge lines as intermediary conductive paths between the mask and ground. These discharge lines act as mediators that safely channel static electricity generated during mask contact away from the transistor board, preventing direct discharge that would cause defects while still allowing the deposition process to proceed.
2Ease of manufacture
If a mask is used for deposition, then deposition can be performed, but plasma deflection causes arching defects
Solution Approach 1:
The discharge lines serve as intermediary conductive structures that provide a controlled path for plasma and static electricity. By positioning these lines strategically around the transistor board, the patent creates intermediate zones that guide plasma flow and prevent uncontrolled arching, maintaining deposition precision while enabling the process.
Solution Approach 2:
The patent replaces mechanical prevention methods (such as physical barriers or complex mask designs) with an electrical field-based solution. The discharge lines create electrical pathways that naturally guide plasma flow and dissipate static charge, substituting mechanical complexity with electrical field management to prevent arching defects.
3Object-affected harmful factors
If anodizing is applied to the mask surface to prevent static electricity, then some protection is provided, but defects still occur
Solution Approach 1:
The patent extracts the static electricity discharge function from the mask itself and relocates it to dedicated discharge lines and a separate circuit system. Instead of relying solely on mask surface treatment like anodizing, the design removes the static charge management function to independent conductive elements that can be optimized specifically for charge dissipation without interfering with the mask's primary deposition function.
Solution Approach 2:
The patent introduces discharge lines as intermediary elements between the mask and the transistor board. These intermediate conductive paths provide a controlled mechanism for static electricity discharge, supplementing or replacing the limited protection from anodized mask surfaces with a more reliable external discharge pathway that directly addresses the root cause of defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents defects caused by static electricity and plasma arcing, ensuring reliable manufacturing of high-integrated display devices by effectively managing electrical discharges during the process.
Implementation Method 1
the inner discharge line may be positioned inside the dam. The discharge link may pass from the outer discharge line side through the dam and contact the inner discharge line
Implementation Method 2
capable of preventing defects by discharging the overcurrent generated during deposition and mask contact
Data Source
AI summary
A display device capable of preventing arching due to deflection of plasma and static electricity by including an outer discharge line, an inner discharge line, a discharge link, and a static electricity discharge circuit electrically connected with the inner discharge line.