Display Driver Bump Layout for Narrow-Bezel Bonding Stability
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Solution Overview
Problem
Conventional display devices face challenges in minimizing the frame width due to deformation issues near the ends of semiconductor elements during thermocompression bonding, which leads to wider frames and potential electrical connection reliability problems.
Innovation Solution
A display device configuration featuring a driver with a quadrangular shape and strategically placed bumps, including a third bump with an oblong shape parallel to inclined second wires, supports the driver's corners and reduces deformation, allowing for a narrower frame and improved electrical connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If bumps are placed near both ends of the first long side to suppress deformation, then warpage is reduced, but the frame width increases due to wire routing interference
Solution Approach 1:
The patent applies asymmetry by placing only one bump near the first end of the first long side, rather than symmetrically placing bumps at both ends. This asymmetric configuration suppresses deformation at the critical first end while avoiding wire routing interference that would occur at the second end, thereby maintaining narrow frame width.
Solution Approach 2:
The patent applies local quality by selectively placing a bump only at the first end of the first long side where deformation occurs during thermocompression bonding, rather than uniformly placing bumps along the entire perimeter. This localized approach addresses the specific deformation problem at the first end without the need for additional bumps that would increase frame width.
2Reliability
If the semiconductor element is thermocompression bonded to the display panel, then electrical connection is achieved, but deformation such as warpage occurs near the ends
Solution Approach 1:
The patent applies preliminary anti-action by placing a bump near the first end of the first long side before thermocompression bonding. This bump acts in advance to prevent deformation during the bonding process, counteracting the warpage that would otherwise occur and compromising electrical connection reliability.
Solution Approach 2:
The patent applies preliminary action by pre-positioning the bump on the semiconductor element before thermocompression bonding. The bump is already in place to provide structural support and prevent deformation during the bonding process, ensuring both electrical connection reliability and structural stability.
3Reliability
If wires are routed to avoid interference with bumps, then electrical connection is maintained, but the routing space increases
Solution Approach 1:
The patent applies asymmetry by placing only one bump near the first end of the first long side, creating an asymmetric configuration that allows wires to be routed along the second long side without interference. This asymmetric bump placement minimizes the wire routing space required while maintaining electrical connection reliability.
Solution Approach 2:
The patent applies taking out by removing the bump from the second end of the first long side where it would interfere with wire routing. This extraction of the bump from the wire routing area eliminates the need for additional routing space while maintaining the deformation suppression function at the first end.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration effectively suppresses warpage and enhances mechanical fixation stability, enabling a narrower frame width and superior electrical connection reliability in the display device.
Implementation Method 1
the terminals and the bumps are connected to each other via an anisotropic conductive film, in which case deformation such as warpage is likely to occur near both ends of the first long side of the driver
Implementation Method 2
electrically connected to the display unit of the display panel
Data Source
AI summary
A display device includes a display panel, a driver 12 including a first side part, a first terminal, a first wire connected to the first terminal, a second terminal located further away from a display area than the first terminal and closer to an end of the first side part than the first terminal, a second wire connected to the second terminal, a first bump disposed to overlap the first terminal, a second bump disposed to overlap the second terminal, and a third bump located closer to the display area than the second bump and closer to the end of the first side part than the first bump. The second wire is extended out from the second terminal toward the end of the first side part, and the third bump has an oblong shape in planar view and has a longitudinal direction parallel with an inclined portion.