Display Support Plate Grooves and Holes for Driver Cooling

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Solution Overview

Problem

Existing display devices, particularly organic light-emitting diode (OLED) displays, face challenges in efficiently dissipating heat from driver circuits, which can impact performance and reliability.

Innovation Solution

The display device incorporates a support plate with grooves or holes that overlap with the driver circuits, allowing for increased air contact and improved heat dissipation, optionally combined with a heat dissipation member within these passages.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a support plate with grooves or holes is introduced to improve heat dissipation, then heat dissipation efficiency is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The support plate is segmented by introducing grooves or holes that divide the plate into multiple regions, creating passages that allow air flow through the driver circuit area. This segmentation enables targeted heat dissipation at the heat-generating components while maintaining structural integrity of the overall support plate.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support plate incorporates porous-like structures in the form of grooves or holes, creating a semi-permeable structure that allows air penetration. These passages function similarly to porous materials by enabling fluid (air) flow through the solid structure, facilitating convective heat transfer from the driver circuits.

Inventive Principle:

Principle #31Porous materials

2Temperature

If grooves or holes are added to the support plate, then air contact is increased for heat dissipation, but manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The manufacturing process is segmented into standard steps (molding, drilling, or routing) that can independently create the grooves or holes. This allows the heat dissipation features to be added as a separate operation rather than requiring complex integrated manufacturing, maintaining ease of production while achieving the thermal management goal.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances heat dissipation efficiency, improving the thermal management of driver circuits and maintaining the performance and reliability of the display device.

Implementation Method 1

The support plate may have a groove or a hole that overlaps with the first driver circuit... allowing for increased air contact and improved heat dissipation

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 2

a heat dissipation member disposed in the groove or the hole of the support plate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250338408A1Display device and electronic device

Publication Date: 2025.10.30 SAMSUNG DISPLAY CO LTD

AI summary

The present disclosure relates to a display device, and more particularly to a display device that can efficiently dissipate heat from a driver circuit, and an electronic device including the same. According to an aspect of the present disclosure, there is provided a display device including: a display panel; a first driver circuit connected to the display panel; and a support plate overlapping with the display panel. The support plate may have a groove or a hole that overlaps with the first driver circuit.