Display Driver IC Stitching Method for High Resolution
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Solution Overview
Problem
The existing methods for manufacturing display driver integrated circuits (DDIs) face limitations in supporting ultra-high density resolutions due to size constraints of reticles, leading to challenges in applying a stitching technique that divides layers, which can result in abnormal operation when the overlapping area includes critical circuits.
Innovation Solution
The method involves asymmetrically applying the stitch method by forming patterns with different reticles in overlapping areas, ensuring only a metal line is present in the overlapping region, with ends of the patterns formed as hammer or ball patterns to improve contact characteristics, and excluding critical circuits from the overlapping area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a stitching technique is applied to manufacture DDIs with ultra-high density resolution, then the DDI can support higher resolutions beyond reticle size limits, but the overlapping area may include critical circuits which can cause abnormal operation
Solution Approach 1:
The patent extracts critical circuits (driving logic circuit and interface circuit) from the overlapping area by positioning them in the center of the DDI, ensuring they are not included in either the first or second area subjected to stitching. This separation eliminates the risk of stitching-induced abnormalities affecting critical circuit operation.
Solution Approach 2:
The DDI is divided into distinct areas: a first area formed by a first reticle, a second area formed by a second reticle, and an overlapping area where these regions intersect. The patterns from both reticles are connected within this overlapping area, enabling the manufacturing of large-sized DDIs that exceed single reticle dimensions.
2Area of stationary object
If patterns are formed using multiple reticles in overlapping areas, then larger DDI sizes can be achieved, but misalignment and contact issues may occur at the boundaries
Solution Approach 1:
The patent applies asymmetric settings to the first and second areas based on the overlapping area configuration before manufacturing. This preliminary design ensures that pattern ends within the overlapping area are properly positioned and connected, preventing misalignment issues during the stitching process.
Solution Approach 2:
The patent employs asymmetric configuration of the first and second areas relative to the overlapping area. This asymmetric design optimizes the connection of patterns from different reticles, ensuring proper contact characteristics and alignment at the boundaries where the first and second patterns meet.
3Adaptability or versatility
If the overlapping area includes transistors or critical circuits, then the DDI functionality can be maintained across the stitched regions, but abnormal operation may occur due to stitching artifacts
Solution Approach 1:
The patent specifically extracts critical circuits (driving logic circuit and interface circuit) from the overlapping area by positioning them in the center of the DDI. This ensures these vital components are not subjected to potential stitching artifacts, maintaining their reliable operation while still allowing the overlapping area to contain necessary metal line connections.
Data Source
AI summary
A display driver integrated circuit and a method of manufacturing the same are provided. The method of manufacturing a display driver integrated circuit (DDI) including a first area, a second area, and an overlapping area in which the first area and the second area overlap each other includes forming a first pattern in the first area using a first reticle; and forming a second pattern in the second area using a second reticle, and ends of the first pattern and the second pattern are connected within the overlapping area and the first area and the second area are asymmetrically set based on the overlapping area such that the overlapping area includes only a metal line.