Display Driving Chip Connection Structure for Pressure Damage Prevention
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Solution Overview
Problem
The existing methods for combining a driving chip with a display substrate often result in damage to signal transfer lines or insulation layers due to pressure application, leading to failures such as disconnection.
Innovation Solution
A display device design that includes a conductive combination member connecting the substrate to the driving chip, with multiple signal lines and connection pads, and a contact member that overlaps these pads, providing a robust connection structure to enhance reliability and protect against bonding failures during the pressing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the driving chip is combined with the substrate through a pressing process, then the driving chip can be electrically connected to the substrate through bumps, but pressure is applied to the combination area causing damage to signal transfer lines or insulation layers leading to disconnection failures
Solution Approach 1:
The patent introduces a multi-layer structure with connection pads at different layers (first connection pad at first layer, second connection pad at second layer). This vertical dimensionality allows the signal transfer line to be routed through the third layer, separating it from the pressure application area at the first layer, thus protecting the signal line from pressure damage while maintaining electrical connection.
Solution Approach 2:
The connection structure is segmented into multiple components: first connection pad, second connection pad, contact member, and signal transfer line at different layers. This segmentation allows the signal transfer line to be spatially separated from the bonding pressure area, enabling the line to avoid direct pressure while still establishing electrical connection through the layered structure.
2Reliability
If a single-layer connection structure is used, then the device complexity is low, but the connection is vulnerable to damage during pressing process
Solution Approach 1:
The patent transitions from a single-layer to a multi-layer structure, utilizing the vertical dimension to separate the signal transfer line from the pressure application area. The first connection pad is at the first layer, the second connection pad is at the second layer, and the signal transfer line is at the third layer, creating a robust three-dimensional connection that protects against bonding failures.
3Reliability
If the signal transfer line is placed directly under the driving chip bonding area, then the connection is direct and simple, but the line is susceptible to damage from bonding pressure
Solution Approach 1:
The signal transfer line is positioned at the third layer, which is vertically separated from the first layer where the driving chip bonding occurs. This dimensional separation allows the signal line to extend from the bonding area without being subjected to bonding pressure, while still maintaining direct electrical connection through the vertically aligned connection pads.
Data Source
AI summary
A display device includes: a display substrate having an active area, which includes a pixel array, and a peripheral area around the active area; a driving chip on the display substrate; and a conductive combination member connecting the display substrate to the driving chip, wherein the display substrate includes: a first signal line in the peripheral area to transfer a driving signal from the driving chip to the active area, the first signal line including a first connection pad; a second connection pad at a different layer from the first connection pad and overlapping at least a portion of the first signal line; and a contact member contacting the first connection pad, the second connection pad, and the conductive combination member.