Display Device Driving Chip Assembly Heat Dissipation
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Solution Overview
Problem
The lifespan of the driving chip in display devices is reduced due to inadequate heat dissipation, leading to increased temperatures.
Innovation Solution
A driving chip assembly with an integrated heat dissipation unit that directly contacts the driving chip and main circuit board, effectively dissipating heat generated by the chip to prevent temperature increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the driving chip operates in the display device, then the display function is achieved, but heat is generated causing temperature rise and reduced lifespan
Solution Approach 1:
A heat dissipation unit is introduced as an intermediary component between the driving chip and the main circuit board. This heat dissipation unit directly contacts both the driving chip and the main circuit board, serving as a thermal conduit to transfer heat away from the driving chip to the main circuit board for dissipation.
Solution Approach 2:
The heat dissipation function is extracted from the main circuit board and implemented as a separate, dedicated heat dissipation unit. This allows the heat dissipation functionality to be optimized independently while maintaining its integration with both the driving chip and the main circuit board.
2Temperature
If heat dissipation structure is added to the driving chip assembly, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The heat dissipation unit is merged with the driving chip assembly as an integrated component. The heat dissipation unit directly contacts both the driving chip and the main circuit board, combining multiple functions (heat dissipation, structural support, and electrical connection) into a single component, thereby reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved heat dissipation performance of the driving chip assembly extends the lifespan of the driving chip by efficiently managing heat, thereby enhancing the overall reliability of the display device.
Implementation Method 1
The heat dissipation unit directly contacts the driving chip and the main circuit board. Therefore, the heat generated by the driving chip is transmitted to the heat dissipation unit, and the heat transmitted to the heat dissipation unit is dissipated to the outside through the main circuit board.
Data Source
AI summary
A display device includes: a display module; a driving chip assembly electrically connected to the display module and including a driving chip and a heat dissipator at least partially surrounding the driving chip; and a main circuit board electrically connected to the driving chip assembly and contacting the heat dissipator.