Display Driving Package Structure Orientation
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Solution Overview
Problem
Conventional chip-on-film (COF) package structures are limited by the maximum effective width of the transmission belt, restricting the number and spacing of chips and output channels, which hampers the yield and maximum output channel number of outer lead bonding.
Innovation Solution
The package structure reorients the longitudinal direction of the input and output connecting units perpendicular to the width direction of the transmission belt, allowing the width and pitch of the driving unit package objects to be independent of the belt's width, thereby increasing the number of chips and output channels without altering the existing process complexity or cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the longitudinal direction of the connecting units is parallel to the moving direction of the transmission belt, then the existing COF package structure can be maintained, but the width of the package structure is limited by the maximum effective width of the transmission belt
Solution Approach 1:
The patent changes the orientation of the connecting units from parallel to perpendicular relative to the transmission belt moving direction. This dimensional reorientation allows the package width to be determined by the belt length rather than belt width, effectively breaking the width limitation and enabling larger package structures while maintaining compatibility with existing transmission belt equipment.
2Quantity of substance
If the transmission belt width is increased to accommodate more chips, then the number of output channels can be increased, but the sprocket hole range reduces the effective width available
Solution Approach 1:
By reorienting the connecting units perpendicular to the belt moving direction, the patent transforms the limiting dimension from belt width to belt length. This allows the effective area for chip placement to increase significantly since the full length of the belt can be utilized, and the sprocket hole range no longer constrains the available placement area.
3Productivity
If the number of chips is increased to raise output channels, then the yield and maximum output channel number of outer lead bonding can be increased, but the chip spacing becomes limited
Solution Approach 1:
The patent enables increased chip density by changing the layout orientation. With connecting units perpendicular to the belt moving direction, chips can be arranged along the entire length of the transmission belt, providing much greater spacing flexibility. This allows more chips to be placed with adequate spacing, thereby increasing both yield and maximum output channel number.
Data Source
AI summary
A package structure applied to a driving apparatus of a display is disclosed. The driving apparatus includes at least one driving unit. The package structure includes a substrate, a first connecting unit, a second connecting unit and at least one package unit. The substrate is used to carry the driving unit. The first connecting unit is disposed at one side of the substrate. A longitudinal direction of the first connecting unit is parallel to a first direction. The second connecting unit is disposed at the other side of the substrate. A longitudinal direction of the second connecting unit is parallel to the first direction. The package unit is used to package the driving unit to form driving unit package object. A longitudinal direction of the driving unit package object is parallel to a second direction. The first direction and the second direction are perpendicular to each other.