Display Function Layer Edge Structure to Prevent Chipping

The patent applies local quality by creating a non-uniform thickness distribution in the function layer, where the edge portion has greater thickness than the body portion. This is achieved through controlled deposition or coating processes that deposit more material at the edges, forming an overhanging structure that provides mechanical reinforcement and improved adhesion at the vulnerable edge regions while maintaining the required thin profile in the light-emitting area.

The patent implements beforehand cushioning by pre-forming the function layer with an overhanging edge structure before subsequent manufacturing steps are performed. This preliminary reinforcement of the edge portion with increased thickness provides a buffer against mechanical stresses and adhesion failures that may occur during later processing or device operation, preventing chipping and peeling before they can initiate.

The patent resolves this contradiction by applying local quality through spatially varying thickness control. The function layer maintains thin thickness (≤40nm) in the body portion to optimize device performance, while the edge portion is deliberately formed with greater thickness to provide mechanical strength and resistance to chipping. This localized differentiation allows simultaneous optimization of both performance and structural integrity.

The patent addresses the thickness-strength contradiction by transitioning from a two-dimensional uniform thickness approach to a three-dimensional varying thickness profile. By introducing vertical dimensionality variation through the overhanging edge structure, the patent achieves enhanced edge strength without compromising the thin-body performance, effectively adding a structural dimension to solve the mechanical vulnerability.